Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Flux and resin composition for flux
US10556299B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10556299-B2 |
| Application number | US-201816306858-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 4, 2018 |
| Priority date | Dec 21, 2017 |
| Publication date | Feb 11, 2020 |
| Grant date | Feb 11, 2020 |
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- Title
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Abstract
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0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
First claim
Opening claim text (preview).
The invention claimed is: 1. A flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux. 2. The flux according to claim 1 , further comprising: a rosin-based resin, and an organic acid excluding the organochlorine compound. 3. The flux according to claim 1 , wherein the organochlorine compound is at least one selected from chlorendic acid, chlorendic anhydride and methyl pentachlorooctadecanoate. 4. The flux according to claim 1 , wherein the amine hydrochloride is ethylamine hydrochloride. 5. The flux according to claim 1 , wherein the phosphonic acid ester is at least one selected from 2-ethylhexyl (2-ethylhexyl) phosphonate, n-octyl (n-octyl) phosphonate, n-decyl (n-decyl) phosphonate and n-butyl (n-butyl) phosphonate. 6. The flux according to claim 1 , wherein the phenyl-substituted phosphinic acid is at least one selected from phenylphosphinic acid and diphenylphosphinic acid. 7. The flux according to claim 1 , for use in a flow soldering method. 8. A resin composition for a flux, comprising: at least one selected from 2.0 to 14.0 mass % of an organochlorine compound and 0.27 to 7.00 mass % of an amine hydrochloride; and 1.0 to 10.0 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole composition for a flux. 9. The resin composition according to claim 8 , further comprising: a rosin-based resin, and an organic acid excluding the organochlorine compound.
Assignees
Inventors
Classifications
Phosphonic compounds, e.g. R—P(:O)(OR')2 · CPC title
Phosphinic compounds, e.g. R2=P(:O)OR' · CPC title
bound to oxygen and to carbon only · CPC title
Amines; Quaternary ammonium compounds · CPC title
aromatic {, e.g. C6H5-CH2-Cl} · CPC title
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Frequently asked questions
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- What does patent US10556299B2 cover?
- 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/362. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).