Secure computation apparatus, secure computation system, secure computation method, and program
US-12475237-B2 · Nov 18, 2025 · US
This page is not indexed by search engines while we improve data quality.
Sudo Hiroki patents
Sudo Hiroki is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sudo Hiroki |
| Total patents | 33 |
| First publication | Nov 29, 2018 |
| Latest publication | Nov 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Secure computation device, secure computation method, and program
US-2025349228-A1 · Nov 13, 2025 · US
Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
US-12447565-B2 · Oct 21, 2025 · US
Secret calculation system, apparatus, method and program
US-12412487-B2 · Sep 9, 2025 · US
Secure computation apparatus, secure computation system, secure computation method, and program
US-12386948-B2 · Aug 12, 2025 · US
Secure computation apparatus, secure computation method, and program
US-2025148095-A1 · May 8, 2025 · US
Secure computation apparatus, secure computation method, and program
US-2025150265-A1 · May 8, 2025 · US
Secret calculation system, apparatus, method and program
US-2025131855-A1 · Apr 24, 2025 · US
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
US-2024424615-A1 · Dec 26, 2024 · US
Solder alloy, solder ball, solder paste, and solder joint
US-12109653-B2 · Oct 8, 2024 · US
Recent patents
Latest publications not already listed above.
Secret survival data processing system, secret survival data processing apparatus, secret survival data processing method, and program
US-12095906-B2 · Sep 17, 2024 · US
Secure computation apparatus, secure computation system, secure computation method, and program
US-2024273219-A1 · Aug 15, 2024 · US
Secure computation apparatus, secure computation system, secure computation method, and program
US-2024273180-A1 · Aug 15, 2024 · US
Secret calculation system, apparatus, method and program
US-2024184577-A1 · Jun 6, 2024 · US
Core material, electronic component and method for forming bump electrode
US-2024100635-A1 · Mar 28, 2024 · US
Secure relational algebraic operation system, secure computation apparatus, secure relational algebraic operation method, and program
US-2024061904-A1 · Feb 22, 2024 · US
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
US-2024024990-A1 · Jan 25, 2024 · US
Core material, electronic component and method for forming bump electrode
US-11872656-B2 · Jan 16, 2024 · US
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint
US-2023173619-A1 · Jun 8, 2023 · US
Computation apparatus, method and program for the same
US-2022413802-A1 · Dec 29, 2022 · US
Secret survival data processing system, secret survival data processing apparatus, secret survival data processing method, and program
US-2022360431-A1 · Nov 10, 2022 · US
Method for forming bump electrode substrate
US-11478869-B2 · Oct 25, 2022 · US
Core material, electronic component and method for forming bump electrode
US-2022212294-A1 · Jul 7, 2022 · US
Solder material, solder paste, and solder joint
US-11344976-B2 · May 31, 2022 · US
Method for forming bump electrode substrate
US-2021387276-A1 · Dec 16, 2021 · US
Cu core ball, solder joint, solder paste and formed solder
US-10888959-B2 · Jan 12, 2021 · US
Solder material, solder paste, and solder joint
US-2020376607-A1 · Dec 3, 2020 · US
Cu core ball, solder joint, solder paste and formed solder
US-10639749-B2 · May 5, 2020 · US
Flux composition for solder applications
US-10610979-B2 · Apr 7, 2020 · US
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
US-2019375054-A1 · Dec 12, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Senju Metal Industry Co | 19 |
| Nippon Telegraph & Telephone | 13 |
| Ntt Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K35/262 | 15 |
| H04L9/085 | 12 |
| H04L2209/46 | 11 |
| B23K35/0244 | 11 |
| B23K35/025 | 11 |