Method for producing base for metal masks, method for producing metal mask for vapor deposition, base for metal masks, and metal mask for vapor deposition

Patent metadata

Field	Value
Publication number	US-11111585-B2
Application number	US-201715786446-A
Country	US
Kind code	B2
Filing date	Oct 17, 2017
Priority date	Jul 17, 2015
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

First claim

The invention claimed is:

1. A method for manufacturing a metal mask substrate, the method comprising:
preparing a rolled metal sheet having a length extending from one end to an opposing end of the rolled metal sheet and the rolled metal sheet including an obverse surface and a reverse surface that is a surface located opposite to the obverse surface, at least one of the obverse surface or the reverse surface being an object to be processed;
reducing a thickness of the rolled metal sheet, along the length of the rolled metal sheet, to 10 μm or less by etching the object to be processed by 3 μm or more by use of an acidic etching liquid such that a maximum thickness of the rolled metal sheet is 10 μm or less, and
roughening the object to be processed so that the processed object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, wherein a metal mask sheet is configured for through holes to be formed in areas of the metal mask sheet having a thickness of 10 μm or less.

2. The method for manufacturing a metal mask substrate according to claim 1 , wherein the object to be processed comprises both the obverse surface and the reverse surface.

3. The method for manufacturing a metal mask substrate according to claim 1 , wherein the object to be processed is either the obverse surface or the reverse surface,
the method further comprising stacking a plastic support layer on a surface located opposite to the object to be processed,
the object to be processed is etched in a state in which the rolled metal sheet and the support layer are stacked together, thereby obtaining a metal mask substrate, in which the metal mask sheet and the support layer are stacked together.

4. The method for manufacturing a metal mask substrate according to claim 2 , wherein
the etching includes etching a first object to be processed that is either the obverse surface or the reverse surface and then etching a second object to be processed that is the remaining one of the obverse surface or the reverse surface,
the method further comprises etching the first object to be processed and then stacking a plastic support layer on the resist formation surface that has been obtained by etching the first object to be processed,
the second object to be processed is etched in a state in which the rolled metal sheet and the support layer are stacked together, thereby obtaining a metal mask substrate in which the metal mask sheet and the support layer are stacked together.

5. The method for manufacturing a metal mask substrate according to claim 1 , wherein
the rolled metal sheet is a rolled invar sheet, and
the metal mask sheet is an invar sheet.

6. The method for manufacturing a metal mask substrate according to claim 1 , additionally comprising forming through holes in the metal mask sheet.

7. The method for manufacturing a metal mask substrate according to claim 1 , wherein after the roughening of the object to be processed the method further comprises:
forming a resist layer on the processed object;
forming a resist mask by subjecting the resist layer to patterning;
etching completely through the metal mask sheet from the resist mask side of the metal mask sheet to form the through holes between the obverse surface and the reverse surface, wherein through hole connection portions are eliminated.

8. A method for manufacturing a vapor deposition metal mask, the method comprising:
forming a metal mask substrate that includes at least one resist formation surface;
forming a resist layer on the one resist formation surface;
forming a resist mask by subjecting the resist layer to patterning; and
etching the metal mask substrate by use of the resist mask,
wherein the metal mask substrate is formed by use of the method for manufacturing a metal mask substrate according to claim 1 .

9. The method for manufacturing a vapor deposition metal mask according to claim 8 , wherein
the metal mask substrate includes a laminate of the metal mask sheet and a plastic support layer, and
the method further comprises chemically removing the support layer from the metal mask substrate by exposing, to alkaline solution, the metal mask substrate, on which the resist mask has been formed.

Assignees

• Toppan Printing Co Ltd

Inventors

• Mikami Naoko
• Tamura Sumika
• Terada Reiji
• Kurata Masashi
• Fujito Daisei
• Nishitsuji Kiyoaki
• Nishi Takehiro

Classifications

• C23F1/28 Primary

  for etching iron group metals · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C23F1/16

  Acidic compositions (C23F1/42 takes precedence) · CPC title

• C23F1/02

  Local etching · CPC title

• C23C14/24

  Vacuum evaporation · CPC title