Direct transfer of multiple graphene layers onto multiple target substrates
US-2017338312-A1 · Nov 23, 2017 · US
Acidic compositions (C23F1/42 takes precedence)
Acidic compositions (C23F1/42 takes precedence) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F1/16 |
| Official title | Acidic compositions (C23F1/42 takes precedence) |
| Display label | Acidic compositions (C23F1/42 takes precedence) |
| Total patents | 289 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 29 |
| 2016 | 26 |
| 2017 | 21 |
| 2018 | 28 |
| 2019 | 21 |
| 2020 | 27 |
| 2021 | 42 |
| 2022 | 25 |
| 2023 | 21 |
| 2024 | 22 |
| 2025 | 22 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of producing die, die, and interior component of vehicle
US-2017292201-A1 · Oct 12, 2017 · US
Substrate processing apparatus, substrate processing method and substrate processing liquid
US-2017221725-A1 · Aug 3, 2017 · US
Etching method, method of manufacturing article, and etching solution
US-9701902-B2 · Jul 11, 2017 · US
Substrate etch
US-9695515-B2 · Jul 4, 2017 · US
Housings for electronic devices
US-2016361854-A1 · Dec 15, 2016 · US
Multi-Layer Ceramic Capacitor and Method of Producing the Same
US-2016351335-A1 · Dec 1, 2016 · US
Method of removing work-affected layer
US-9481934-B2 · Nov 1, 2016 · US
Etch chemistries for metallization in electronic devices
US-9455283-B2 · Sep 27, 2016 · US
Method of fabricating structures, starting from material rods
US-2016265120-A1 · Sep 15, 2016 · US
Fluidic machining method and system
US-2016258299-A1 · Sep 8, 2016 · US
Nonparallel island etching
US-2016244885-A1 · Aug 25, 2016 · US
Template forming method, template, and template base material
US-2016247673-A1 · Aug 25, 2016 · US
CMP compositions exhibiting reduced dishing in STI wafer polishing
US-9422455-B2 · Aug 23, 2016 · US
Cleaning composition and method of manufacturing metal wiring using the same
US-2016230289-A1 · Aug 11, 2016 · US
Substrate treatment method and substrate treatment equipment
US-2016233082-A1 · Aug 11, 2016 · US
Metal/resin composite structure
US-2016221301-A1 · Aug 4, 2016 · US
Substrate Etch
US-2016208394-A1 · Jul 21, 2016 · US
Methods and systems for forming a dual layer housing
US-9387612-B2 · Jul 12, 2016 · US
Polishing composition
US-9390938-B2 · Jul 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F1/16?
- CPC C23F1/16 is the Cooperative Patent Classification code for “Acidic compositions (C23F1/42 takes precedence).”
- How many patents are filed under CPC C23F1/16 (Acidic compositions (C23F1/42 takes precedence))?
- Our database includes 289 publications tagged with this CPC code.
- Is patent activity under CPC C23F1/16 growing?
- Publication counts under this code: 22 in 2024 vs 22 in 2025 (latest complete years).