Metal mask substrate for vapor deposition, metal mask for vapor deposition, production method for metal mask substrate for vapor deposition, and production method for metal mask for vapor deposition

Patent metadata

Field	Value
Publication number	US-2018038002-A1
Application number	US-201715786455-A
Country	US
Kind code	A1
Filing date	Oct 17, 2017
Priority date	Jul 17, 2015
Publication date	Feb 8, 2018
Grant date	—

Abstract

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.

First claim

1 . A vapor deposition metal mask substrate comprising a nickel-containing metal sheet including an obverse surface and a reverse surface, which is opposite to the obverse surface, wherein
at least one of the obverse surface and the reverse surface is a target surface for placing a resist layer, the target surface has a surface roughness Sa of less than or equal to 0.019 μm, and the target surface has a surface roughness Sz of less than or equal to 0.308 μm.

2 . The vapor deposition metal mask substrate according to claim 1 , wherein a specular reflectance of incident light to the target surface is between 53.0% and 97.0%, inclusive.

3 . The vapor deposition metal mask substrate according to claim 2 , wherein
two directions that are perpendicular to each other in the target surface are directions in which light is incident as viewed facing the target surface, and a difference in the reflectance between the two directions is less than or equal to 3.6%.

4 . A vapor deposition metal mask substrate comprising a nickel-containing metal sheet including an obverse surface and a reverse surface, which is opposite to the obverse surface, wherein
at least one of the obverse surface and the reverse surface is a target surface for placing a resist layer, and a specular reflectance of incident light to the target surface is between 53.0% and 97.0%, inclusive.

5 . The vapor deposition metal mask substrate according to claim 4 , wherein
two directions that are perpendicular to each other in the target surface are directions in which light is incident as viewed facing the target surface, and a difference in the reflectance between the two directions is less than or equal to 3.6%.

6 . The vapor deposition metal mask substrate according to claim 1 , wherein the nickel-containing metal sheet is an invar sheet.

7 . A method for manufacturing a vapor deposition metal mask substrate, the method comprising:
forming a nickel-containing metal sheet on an electrode surface by electrolysis; and separating the nickel-containing metal sheet from the electrode surface, wherein the nickel-containing metal sheet includes an obverse surface and a reverse surface, which is opposite to the obverse surface, at least one of the obverse surface and the reverse surface is a target surface for placing a resist layer, and the electrolysis causes the target surface to have a surface roughness Sa of less than or equal to 0.019 μm and causes the target surface to have a surface roughness Sz of less than or equal to 0.308 μm.

8 . A method for manufacturing a vapor deposition metal mask substrate, the method comprising:
forming a nickel-containing metal sheet on an electrode surface by electrolysis; and separating the nickel-containing metal sheet from the electrode surface, wherein the nickel-containing metal sheet includes an obverse surface and a reverse surface, which is opposite to the obverse surface, at least one of the obverse surface and the reverse surface is a target surface for placing a resist layer, and the electrolysis causes a specular reflectance of incident light to the target surface to be between 53.0% and 97.0%, inclusive.

Assignees

• Toppan Printing Co Ltd

Inventors

• Tamura Sumika
• Shinno Mikio
• Fujito Daisei
• Nishitsuji Kiyoaki
• Nishi Takehiro
• Mikami Naoko

Classifications

• C25B11/055

  characterised by the substrate or carrier material · CPC title

• C25C1/08

  of nickel or cobalt · CPC title

• C25D5/16

  Electroplating with layers of varying thickness · CPC title

• C25D1/10

  Moulds; Masks; Masterforms · CPC title

• C25D11/34

  of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title