Liner for processing chamber

Patent metadata

Field	Value
Publication number	US-11021790-B2
Application number	US-201916521826-A
Country	US
Kind code	B2
Filing date	Jul 25, 2019
Priority date	Aug 6, 2018
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.

First claim

We claim:

1. A liner for a processing chamber, comprising: an outer portion with an inner surface and an outer surface; an inner portion with an inner surface and an outer surface; a first coating material disposed on at least a portion of the inner surface of the inner portion; and a second coating material disposed on at least a portion of the outer surface of the inner portion and on at least a portion of the inner surface of the outer portion; wherein a portion of the inner surface of the outer portion is in contact with the outer surface of the inner portion and at least one junction point having a contact area between the portion of the inner surface of the outer portion and the outer surface of the inner portion; and the first coating material has a higher absorption coefficient than the second coating material.

2. The liner of claim 1 , wherein the first coating material is SiC.

3. The liner of claim 1 , wherein the second coating material is flame polished quartz.

4. The liner of claim 1 , wherein the first coating material is SiC and the second coating material flame polished quartz.

5. The liner of claim 1 , wherein the contact area is less than a non-contact area between the inner surface of the outer portion and the outer surface of the inner portion.

6. The liner of claim 5 , wherein the contact area is less than 10% the non-contact area.

7. The liner of claim 1 , wherein the inner portion and the outer portion are at least partially separated by a gap.

8. The liner of claim 1 , wherein the inner portion and the outer portion are made of quartz.

9. A processing chamber, comprising: a substrate support assembly within a chamber body designed to support a substrate; at least one lamp designed to heat the substrate disposed on the substrate support; a cooling channel configured to receive a cooling fluid into the chamber body; a liner, the liner comprising: an outer portion with an inner surface and an outer surface; an inner portion with an inner surface and an outer surface; a first coating material disposed on at least a portion of the inner surface of the inner portion; and a second coating material disposed on at least a portion of the outer surface of the inner portion and on at least a portion of the inner surface of the outer portion; wherein a portion of the inner surface of the outer portion is in thermal contact with the outer surface of the inner portion at at least one junction point having a contact area between the portion of the inner surface of the outer portion and the outer surface of the inner portion; and the inner portion has a first thermal mass and the outer portion has a second thermal mass, and the first thermal mass is less than the second thermal mass; and the first coating material having a higher absorption coefficient than the second coating material.

10. The processing chamber of claim 9 , wherein the contact area is less than a non-contact area between the inner surface of the outer portion and the outer surface of the inner portion.

11. The processing chamber of claim 10 , wherein the contact area is less than 10% the non-contact area.

12. The processing chamber of claim 9 , wherein the first coating material is SiC and the second coating material is flame polished quartz.

13. The processing chamber of claim 9 , wherein the inner portion and the outer portion are at least partially separated by a gap.

14. The processing chamber of claim 9 , wherein the outer surface of the outer portion is deposited on a portion of a base ring.

15. The processing chamber of claim 9 , wherein the processing chamber is an epitaxial chamber.

Assignees

• Applied Materials Inc

Inventors

• Cong Zhepeng
• Chu Schubert
• Myo Nyi O
• Shah Kartik
• Kumar Surajit

Classifications

• C23C16/4411 Primary

  Cooling of the reaction chamber walls (C23C16/45572 takes precedence) · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• C23C16/44 Primary

  characterised by the method of coating (C23C16/04 takes precedence) · CPC title

• C23C16/4583

  the substrate being supported substantially horizontally · CPC title

• C23C16/4401

  Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber · CPC title