Apparatus for impurity layered epitaxy

Patent metadata

Field	Value
Publication number	US-9856580-B2
Application number	US-201414444640-A
Country	US
Kind code	B2
Filing date	Jul 28, 2014
Priority date	Aug 19, 2013
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

Embodiments of the disclosure relate to an apparatus for processing a semiconductor substrate. The apparatus includes a process chamber having a substrate support for supporting a substrate, a lower dome and an upper dome opposing the lower dome, a plurality of gas injects disposed within a sidewall of the process chamber. The apparatus includes a gas delivery system coupled to the process chamber via the plurality of gas injects, the gas delivery system includes a gas conduit providing one or more chemical species to the plurality of gas injects via a first fluid line, a dopant source providing one or more dopants to the plurality of gas injects via a second fluid line, and a fast switching valve disposed between the second fluid line and the process chamber, wherein the fast switching valve switches flowing of the one or more dopants between the process chamber and an exhaust.

First claim

The invention claimed is:

1. An apparatus for processing a semiconductor substrate, comprising:
an epitaxial process chamber, comprising:
a substrate support disposed within the process chamber;
a lower dome disposed relatively below the substrate support;
an upper dome disposed relatively above the substrate support, the upper dome being opposed to the lower dome; and
a plurality of gas injects disposed within a sidewall of the process chamber; and

a gas delivery system coupled to the epitaxial process chamber via the plurality of gas injects, the gas delivery system comprising:
a gas conduit for providing one or more chemical species to the plurality of gas injects via a first fluid line;
a dopant source for providing one or more dopants to the plurality of gas injects via a second fluid line; and
a fast switching valve disposed between the second fluid line and the epitaxial process chamber, wherein the fast switching valve switches flowing of the one or more dopants between the epitaxial process chamber and an exhaust, and wherein the fast switching valve switches flowing of the one or more dopants between the epitaxial process chamber and the exhaust for less than 50 ms.

2. The apparatus of claim 1 , wherein the fast switching valve provides a short pulsed dosing of the one or more dopants at a pulse repetition rate of about 0.05 seconds to about 20 seconds.

3. The apparatus of claim 1 , further comprising:
a valve disposed between the first fluid line and the epitaxial process chamber, wherein the valve switches flowing of the one or more chemical species between the epitaxial process chamber and the exhaust.

4. The apparatus of claim 1 , wherein the dopant source further provides a dilution gas to the plurality of gas injects via the second fluid line.

5. The apparatus of claim 4 , wherein the dilution gas has a volumetric flow rate to the dopant volumetric flow rate ratio of about 1:1 to about 20:1.

6. A process chamber for processing a substrate, comprising:
a rotatable substrate support disposed within an epitaxial process chamber;
a lower dome disposed relatively below the substrate support;
an upper dome disposed relatively above the substrate support, the upper dome being opposed to the lower dome;
a ring body disposed between the upper dome and the lower dome, wherein the upper dome, the ring body, and the lower dome generally defining an internal volume of the process chamber, the ring body having a plurality of gas injects arranged in at least one linear group; and
a gas delivery system coupled to the epitaxial process chamber via the plurality of gas injects, the gas delivery system comprising:
a first fluid line;
a first gas conduit for providing a first set of chemical species to the plurality of gas injects via the first fluid line;
a second fluid line;
a first dopant source for providing first dopants to the plurality of gas injects via the second fluid line; and
a fast switching valve disposed between the second fluid line and the epitaxial process chamber, wherein the fast switching valve switches flowing of the first dopants between the epitaxial process chamber and an exhaust, and wherein the fast switching valve switches flowing of the first dopants between the epitaxial process chamber and the exhaust for less than 50 ms.

7. The process chamber of claim 6 , wherein the fast switching valve provides a short pulsed dosing of the first dopants at a pulse repetition rate of about 0.05 seconds to about 20 seconds.

8. The process chamber of claim 6 , wherein the first dopant source provides a dilution gas to the plurality of gas injects via the second fluid line.

9. The process chamber of claim 8 , wherein the dilution gas has a volumetric flow rate to the first dopant volumetric flow rate ratio of about 1:1 to about 20:1.

Assignees

• Applied Materials Inc

Inventors

• Sanchez Errol Antonio C
• Srinivasan Swaminathan T

Classifications

• C30B29/52

  Alloys · CPC title

• C30B29/36

  Carbides · CPC title

• C30B29/06

  Silicon · CPC title

• C30B25/08 Primary

  Reaction chambers; Selection of materials therefor · CPC title

• C30B25/12

  Substrate holders or susceptors · CPC title