Silicon-on-insulator substrate and method of manufacturing the same
US-12419081-B2 · Sep 16, 2025 · US
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Zhang Sheng patents
Zhang Sheng is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zhang Sheng |
| Total patents | 18 |
| First publication | Oct 3, 2017 |
| Latest publication | Sep 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Manufacturing method of semiconductor structure
US-12278210-B2 · Apr 15, 2025 · US
Chips bonding auxiliary structure
US-12266578-B2 · Apr 1, 2025 · US
Semiconductor structure
US-12249607-B2 · Mar 11, 2025 · US
Manufacturing method of semiconductor structure
US-2023411343-A1 · Dec 21, 2023 · US
Semiconductor structure
US-2023154926-A1 · May 18, 2023 · US
Silicon-on-insulator substrate and method of manufacturing the same
US-2023094739-A1 · Mar 30, 2023 · US
Semiconductor structure and manufacturing method thereof
US-11605648-B2 · Mar 14, 2023 · US
Semiconductor structure and manufacturing method thereof
US-2022415926-A1 · Dec 29, 2022 · US
Method for measuring chips bonding strength and chips bonding auxiliary structure
US-2022399239-A1 · Dec 15, 2022 · US
Recent patents
Latest publications not already listed above.
Method for measuring chips bonding strength and chips bonding auxiliary structure
US-11456221-B2 · Sep 27, 2022 · US
Method for measuring chips bonding strength and chips bonding auxiliary structure
US-2021358818-A1 · Nov 18, 2021 · US
Manufacturing method of semiconductor device
US-10622253-B2 · Apr 14, 2020 · US
Wafer level packaging method
US-10580823-B2 · Mar 3, 2020 · US
Manufacturing method of semiconductor device
US-2019378757-A1 · Dec 12, 2019 · US
Wafer level packaging method
US-2018323227-A1 · Nov 8, 2018 · US
Method of manufacturing semiconductor device for reducing grain size of polysilicon
US-9852912-B1 · Dec 26, 2017 · US
Flash cell structure and method of fabricating the same
US-9780101-B1 · Oct 3, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 18 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W10/181 | 8 |
| H10D30/0323 | 8 |
| H10P90/1922 | 6 |
| H10D86/201 | 6 |
| H10W80/312 | 4 |