Chips bonding auxiliary structure

Patent metadata

Field	Value
Publication number	US-12266578-B2
Application number	US-202217892326-A
Country	US
Kind code	B2
Filing date	Aug 22, 2022
Priority date	May 12, 2020
Publication date	Apr 1, 2025
Grant date	Apr 1, 2025

Abstract

A chips bonding auxiliary structure includes a first chip, an auxiliary pattern and a second chip. The first chip has a first surface. The auxiliary pattern is form on the first surface. The second chip has a second surface bonding to the first surface to form at least one gap space surrounding the auxiliary pattern.

First claim

What is claimed is:

1. A chips bonding auxiliary structure, comprising:
a first chip having a first surface;
an auxiliary pattern form on the first surface and comprising a plurality of convex pillars, wherein each of the plurality of convex pillars shapes as a cone, and each of the plurality of convex pillars is formed of silicon dioxide; and
a second chip having a second surface bonding to the first surface to form a plurality of gap spaces, wherein each of the plurality of gap spaces is a circular chamber surrounding at least one of the plurality of convex pillars, and the circular chambers are separated from each other.

2. The chips bonding auxiliary structure according to claim 1 , wherein each of the plurality of convex pillars has a bottom area substantially ranging from 0.002 mm 2 to 0.03 mm 2 and an average height h ranges from 50 μm to 100 μm; and each of the plurality of gap spaces has a projected area ranging from 500 mm 2 to 1000 mm 2 .

3. The chips bonding auxiliary structure according to claim 2 , wherein each of the plurality of gap spaces correspondingly surrounds single one of the plurality of convex pillars.

4. The chips bonding auxiliary structure according to claim 2 , wherein each of the plurality of gap spaces correspondingly surrounds several ones of the plurality of convex pillars.

5. The chips bonding auxiliary structure according to claim 2 , wherein the plurality of convex pillars are evenly distributed on the first surface.

6. The chips bonding auxiliary structure according to claim 2 , wherein the plurality of convex pillars are distributed adjacent to an edge of the first surface.

7. The chips bonding auxiliary structure according to claim 1 , wherein there is a bonding strength between the first chip and the second chip ranging from 1 Joule/square meter (J/m 2 ) to 4 J/m 2 .

8. The chips bonding auxiliary structure according to claim 1 , wherein at least one of the first chip and the second chip is bent.

Assignees

• United Microelectronics Corp

Inventors

• Zhang Sheng
• Pang Chien-Kee
• Zhao Xin

Classifications

• H10P74/27

  Structural arrangements therefor · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01N19/04 Primary

  Measuring adhesive force between materials, e.g. of sealing tape, of coating · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title