Electronic device comprising printed circuit board including thermal interface material
US-2026046998-A1 · Feb 12, 2026 · US
Yoon Jeonggen is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yoon Jeonggen |
| Total patents | 14 |
| First publication | Aug 13, 2020 |
| Latest publication | Feb 12, 2026 |
Publications ranked by popularity score, then publication date.
US-2026046998-A1 · Feb 12, 2026 · US
US-2026032802-A1 · Jan 29, 2026 · US
US-2025365907-A1 · Nov 27, 2025 · US
US-2025318083-A1 · Oct 9, 2025 · US
US-2025220854-A1 · Jul 3, 2025 · US
US-2025159844-A1 · May 15, 2025 · US
US-11805633-B2 · Oct 31, 2023 · US
US-11646400-B2 · May 9, 2023 · US
US-11355365-B2 · Jun 7, 2022 · US
US-2021305477-A1 · Sep 30, 2021 · US
Latest publications not already listed above.
US-11056630-B2 · Jul 6, 2021 · US
US-2021136966-A1 · May 6, 2021 · US
US-2020321229-A1 · Oct 8, 2020 · US
US-2020259056-A1 · Aug 13, 2020 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 14 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 6 |
| H10W20/031 | 4 |
| H10H29/0364 | 4 |
| H10H29/857 | 4 |
| H10H29/49 | 4 |