Electronic device including heat dissipation member

Patent metadata

Field	Value
Publication number	US-2025220854-A1
Application number	US-202519009865-A
Country	US
Kind code	A1
Filing date	Jan 3, 2025
Priority date	Jan 3, 2024
Publication date	Jul 3, 2025
Grant date	—

Abstract

The disclosure relates to an electronic device. According to an embodiment of the disclosure, the electronic device may include a first substrate including a first surface and a second surface opposite to the first surface, a second substrate including a third surface facing the first surface and a fourth surface opposite to the third surface, at least one interposer between the first surface and the second surface, a first electronic component on the fourth surface, and a heat dissipation member which is in a solid phase at room temperature and is in a space defined by the first substrate, the second substrate, and the at least one interposer so as to overlap with the first electronic component when viewed in a direction perpendicular to the fourth surface.

First claim

1 . An electronic device comprising:
a first substrate comprising a first surface and a second surface opposite to the first surface; a second substrate comprising a third surface facing the first surface and a fourth surface opposite to the third surface; at least one interposer between the first surface and the third surface and electrically connecting the first substrate and the second substrate; a first electronic component on the fourth surface; and a heat dissipation member being in a solid phase at room temperature and in a space defined by the first substrate, the second substrate, and the at least one interposer so as to overlap with the first electronic component when viewed in a direction orthogonal to the fourth surface.

2 . The electronic device of claim 1 , wherein the heat dissipation member is in a gel phase within a temperature range above a softening point higher than room temperature.

3 . The electronic device of claim 2 , further comprising a solder electrically connecting the at least one interposer with the first substrate or the second substrate,
wherein the heat dissipation member is configured to maintain being in the gel phase at a melting point of the solder which is higher than the softening point.

4 . The electronic device of claim 1 , further comprising at least one second electronic component on the third surface of the second substrate,
wherein the heat dissipation member comprises a contacting portion which contacts at least one of the third surface or the at least one second electronic component.

5 . The electronic device of claim 4 ,
wherein the at least one second electronic component comprises a plurality of decoupling capacitors between the heat dissipation member and the first electronic component and electrically connected to the first electronic component via the second substrate, wherein the contacting portion of the heat dissipation member is between the plurality of decoupling capacitors and contacts the third surface.

6 . The electronic device of claim 4 , further comprising a third electronic component on the first surface of the first substrate and at least partially covered by the heat dissipation member.

7 . The electronic device of claim 1 ,
wherein the heat dissipation member comprises: a phase change material having a melting point ranging from 40 degrees Celsius to 60 degrees Celsius; and a matrix material configured to maintain the heat dissipation member in a gel phase at a temperature higher than the melting point of the phase change material.

8 . The electronic device of claim 7 ,
wherein the heat dissipation member further comprises a tackifier configured to provide tack to the phase change material.

9 . The electronic device of claim 8 , wherein:
the matrix material comprises a thermoplastic organic material, and the tackifier comprises a petroleum hydrocarbon resin.

10 . The electronic device of claim 9 ,
wherein the tackifier comprises at least one functional group different from a functional group of the matrix material.

11 . The electronic device of claim 8 ,
wherein the tackifier has a glass transition temperature higher than the melting point of the phase change material.

12 . The electronic device of claim 11 ,
wherein a weight ratio of the phase change material and the tackifier is 1:1.

13 . The electronic device of claim 1 , further comprising an adhesive member between the first surface of the first substrate and the heat dissipation member.

14 . The electronic device of claim 13 , wherein the adhesive member comprises:
a first adhesive layer on the first surface of the first substrate; and a second adhesive layer between the first adhesive layer and the heat dissipation member and comprising a hot melt adhesive.

15 . The electronic device of claim 13 , wherein the heat dissipation member is in contact with the first surface of the first substrate through the adhesive member and is in contact with the third surface of the second substrate.

16 . The electronic device of claim 1 , wherein the heat dissipation member is in contact with an area of the third surface, which overlaps with the first electronic component when viewed in the direction orthogonal to the fourth surface.

17 . The electronic device of claim 1 ,
wherein the at least one interposer is elongated along an edge of the first surface of the first substrate so as to at least partially surround the heat dissipation member.

18 . An electronic device comprising:
a first substrate comprising a first surface and a second surface opposite to the first surface; a second substrate comprising a third surface facing the first surface and a fourth surface opposite to the third surface; at least one interposer between the first surface and the third surface electrically connecting the first substrate and the second substrate; an electronic component on the second surface; and a heat dissipation member which is in a solid phase at room temperature and in a space defined by the first substrate, the second substrate, and the at least one interposer so as to overlap with the first electronic component when viewed in a direction orthogonal to the second surface.

19 . The electronic device of claim 18 , wherein the heat dissipation member is in a gel phase within a temperature range equal to or higher than a softening point higher than room temperature.

20 . The electronic device of claim 19 , further comprising:
a solder electrically connecting the at least one interposer with the first substrate or the second substrate, wherein the heat dissipation member is configured to maintain being in the gel phase at a melting point of the solder which is higher than the softening point.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Min
• Son Jihyeon
• Jung Jinhwan
• Kim Boram
• Nam Hyungjong
• Moon Youngjoo
• Yoon Jeonggen
• Lee Kyuhwan
• Lee Haejin
• Chang Yoonhee
• HWANG Jieun

Classifications

• H10W40/251

  Organics · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• G06F1/1658

  related to the mounting of internal components, e.g. disc drive or any other functional module · CPC title

• G06F1/1626

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title