Electronic device including heat dissipation member

Patent metadata

Field	Value
Publication number	US-2025159844-A1
Application number	US-202418946026-A
Country	US
Kind code	A1
Filing date	Nov 13, 2024
Priority date	Nov 14, 2023
Publication date	May 15, 2025
Grant date	—

Abstract

The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

First claim

What is claimed is:

1 . An electronic device comprising:
a printed circuit board; a first electronic component mounted on the printed circuit board; a second electronic component mounted on a first area of a surface of the first electronic component; and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component, wherein the heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

2 . The electronic device of claim 1 , wherein the heat dissipation member is configured to:
be in the solid phase at room temperature; and be softened based on a temperature of the heat dissipation member exceeding a threshold temperature higher than the room temperature.

3 . The electronic device of claim 2 ,
wherein the heat dissipation member is configured to have a compressibility equal to or greater than 35% based on a temperature of the heat dissipation member exceeding the threshold temperature.

4 . The electronic device of claim 2 ,
wherein the heat dissipation member is configured to be at least partially in a gel phase when a temperature of the heat dissipation member exceeds the threshold temperature.

5 . The electronic device of claim 1 ,
wherein the heat dissipation member comprises: a first portion contacting a top surface of the second electronic component; and a second portion protruding from the first portion toward the second area of the surface of the first electronic component.

6 . The electronic device of claim 2 ,
wherein, based on the temperature of the heat dissipation member exceeding the threshold temperature, the heat dissipation member is configured to contact a lateral surface of the second electronic component.

7 . The electronic device of claim 1 ,
wherein the heat dissipation member comprises: a paraffin based phase change material configured to be in the solid phase at room temperature and configured to be changed from the solid phase to a liquid phase or to a gel phase at a threshold temperature.

8 . The electronic device of claim 2 ,
wherein the threshold temperature is lower than a throttling temperature of the first electronic component.

9 . The electronic device of claim 1 ,
wherein the first electronic component comprises multiple processing cores, and wherein a threshold temperature is lower than throttling temperatures of the multiple processing cores.

10 . The electronic device of claim 5 ,
wherein the heat dissipation member comprises at least one interface portion positioned at the first portion of the heat dissipation member, the at least one interface portion extending between a first surface and a second surface of the first portion.

11 . The electronic device of claim 5 ,
wherein the first portion and the second portion of the heat dissipation member are bonded to each other by heating.

12 . The electronic device of claim 5 ,
wherein the second portion of the heat dissipation member is non-conductive, and the first portion of the heat dissipation member is conductive.

13 . The electronic device of claim 5 ,
wherein the surface of the first electronic component comprises a top surface including the first area and the second area, and a lateral surface, and wherein the heat dissipation member further comprises a third portion protruding from the second portion toward the printed circuit board and contacting at least a portion of the lateral surface of the first electronic component.

14 . The electronic device of claim 5 ,
wherein a thermal conductivity of the second portion of the heat dissipation member is greater than a thermal conductivity of the first portion of the heat dissipation member.

15 . The electronic device of claim 1 , further comprising:
a shield can disposed on the printed circuit board and surrounding the first electronic component and the second electronic component, the shield can comprising an opening where the heat dissipation member is accommodated; and a conductive layer covering the opening of the shield can and contacting a first surface and a second surface of the heat dissipation member.

16 . The electronic device of claim 15 ,
wherein the conductive layer comprises: a first conductive sheet contacting the first surface of the heat dissipation member; and a second conductive sheet interposed between the shield can and the first conductive sheet and surrounding the second surface of the heat dissipation member and contacting the second surface of the heat dissipation member.

17 . The electronic device of claim 16 ,
wherein a thermal conductivity of the second conductive sheet is lower than a thermal conductivity of the first conductive sheet.

18 . The electronic device of claim 15 , further comprising:
a coating layer coated on a second surface opposite to a first surface of the conductive layer which contacts the heat dissipation member and including a non-conductive heat dissipation material.

19 . The electronic device of claim 1 ,
wherein the first electronic component comprises at least one processing core, and wherein the second electronic component is operably connected to the at least one processing core and stores instructions executable by the at least one processing core.

20 . The electronic device of claim 19 ,
wherein, when viewed from above the top surface of the second electronic component, the at least one processing core at least partially overlaps with the second area of the surface of the first electronic component.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Boram
• Kwon Ohhyuck
• Kim Youngjin
• Park Min
• Sung Jungoh
• Son Changjong
• Chang Yoonhee
• Jung Jinhwan
• HWANG Jieun
• Son Jihyeon
• Yoon Jeonggen

Classifications

• H05K9/0024

  Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title