Electronic device including shield can

Patent metadata

Field	Value
Publication number	US-2025365907-A1
Application number	US-202519236309-A
Country	US
Kind code	A1
Filing date	Jun 12, 2025
Priority date	May 21, 2024
Publication date	Nov 27, 2025
Grant date	—

Abstract

An electronic device is provided. The electronic device includes a printed circuit board, an electronic component disposed on the printed circuit board, a shield can including a planar portion having a seating portion formed as a groove including an injection hole, and a side portion which extending from the planar portion, the shield can being coupled to the printed circuit board to cover the electronic component, a cover member disposed in the seating portion of the shield can, and a heat transfer material filled inside the shield can, wherein the cover member is bendable for insertion of an external object for injecting the heat transfer material inside the shield can through the injection hole.

First claim

What is claimed is:

1 . An electronic device comprising:
a printed circuit board; an electronic component disposed on the printed circuit board; a shield can comprising:
a planar portion having a seating portion formed as a groove including an injection hole, and
a side portion extending from the planar portion, the shield can being coupled to the printed circuit board to shield the electronic component;
a cover member disposed in the seating portion of the shield can; and a heat transfer material filled inside the shield can, wherein the cover member is bendable for insertion of an external object for injecting the heat transfer material inside the shield can through the injection hole.

2 . The electronic device of claim 1 , wherein the cover member comprises multiple cut parts configured to be bendable for insertion of the external object.

3 . The electronic device of claim 1 ,
wherein the seating portion is formed as the groove having a shape corresponding to the cover member, and wherein the injection hole is formed in the groove.

4 . The electronic device of claim 1 , wherein the injection hole, when viewed from a direction perpendicular to the planar portion of the shield can, does not overlap with at least a portion of the electronic component.

5 . The electronic device of claim 3 , wherein the groove of the seating portion is formed to have a depth configured to accommodate the cover member.

6 . The electronic device of claim 1 ,
wherein the groove of the seating portion is formed as a hole in a shape corresponding to the cover member, and wherein the hole is formed to have a depth that accommodates the cover member.

7 . The electronic device of claim 6 , further comprising:
at least one plate coupled with one surface of the cover member and coupled with the planar portioninside the shield can.

8 . The electronic device of claim 1 , wherein the shield can comprises:
an opening which is formed in the side portion of the shield can and faces a circuit of the printed circuit board; and a first partition wall portion which is positioned between the printed circuit board and the planar portion of the shield can and comprises at least a portion facing the opening to block the heat transfer material from flowing into the opening.

9 . The electronic device of claim 8 , wherein the first partition wall portion extends at least partially to the side portion to shield the opening.

10 . The electronic device of claim 1 ,
wherein the electronic component includes a communication module, and wherein the shield can comprises:
a second partition wall portion located between the printed circuit board and the planar portion of the shield can, and
at least partially enclosing the communication module to isolate the communication module from a surrounding space inside the shield can.

11 . The electronic device of claim 1 , wherein the heat transfer material includes polymer silicone resin of about 1.3 to 4% by weight, and small molecule silicone resin of about 0.5 to 1.5% by weight.

12 . The electronic device of claim 11 , wherein the heat transfer material includes silicone oil of about 0.1 to 1.5% by weight.

13 . The electronic device of claim 11 , wherein the heat transfer material has a viscosity of 20,0000 CPS to 600,000 CPS.

14 . The electronic device of claim 11 , wherein the heat transfer material includes heat-dissipating particles of about 90 to 95% by weight.

15 . The electronic device of claim 14 , wherein the heat-dissipating particles include at least one of Al 2 O 3 , AlN, SiC, Boron Nitride (BN), Si 3 N 4 , Carbon fibers, Graphene, or Graphite.

16 . The electronic device of claim 14 , wherein the heat transfer material has a thermal conductivity of 7 to 10 W/mK.

17 . An electronic device comprising:
a printed circuit board; an electronic component disposed on the printed circuit board; a shield can comprising:
a planar portion comprising an injection hole, and
a side portion extending from the planar portion and comprising an opening, the shield can being coupled to the printed circuit board so as to cover the electronic component;
a heat transfer material filled inside the shield can through the injection hole; and a first partition wall portion which is positioned between the printed circuit board and the planar portion of the shield can in the shield can and at least a portion of which faces the opening to block the heat transfer material from flowing into the opening.

18 . The electronic device of claim 17 , wherein the first partition wall portion has at least a portion extending to the side portion in which the opening is formed, so as to shield the opening.

19 . The electronic device of claim 17 , further comprising:
a communication module disposed on the printed circuit board; and a second partition wall portion which is positioned between the printed circuit board and the planar portion of the shield can in the shield can and at least a portion of which surrounds the communication module to isolate the communication module from a space around the communication module in the shield can.

20 . The electronic device of claim 17 , further comprising:
a cover member which is disposed in the shield can to shield the injection hole and comprises multiple cut parts bent in a direction into which an external object is inserted, wherein the shield can comprises a seating portion which has an injection hole formed therethrough and is formed to have a hole shape or a groove shape which allows the cover member to be disposed therein.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Min
• Yoon Jeonggen
• HWANG Jieun
• Son Jihyeon
• Chang Yoonhee
• Jung Dongkee
• Jung Jinhwan
• Jeon Il
• Lee Sungbok
• Lee Howon
• Huh Jaeyoung

Classifications

• H05K7/20463

  Filling compound, e.g. potted resin · CPC title

• H05K9/0032 Primary

  having multiple parts, e.g. frames mating with lids · CPC title

• H05K9/006

  specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier · CPC title

• H05K9/0024 Primary

  Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title