Transfer apparatus of an electronic component

Patent metadata

Field	Value
Publication number	US-11355365-B2
Application number	US-201816761905-A
Country	US
Kind code	B2
Filing date	Dec 3, 2018
Priority date	Dec 1, 2017
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

First claim

What is claimed is:

1. A micro-chip gripper comprising:
a pin plate having a first surface;
a hole plate having a first surface facing a second surface of the pin plate and being spaced apart therefrom, the hole plate being movable together with the pin plate and including a plurality of holes formed therethrough;
pins supported at first end portions thereof by the pin plate, each pin inserted into and being movable within a corresponding one of the plurality of holes of the hole plate; and
an adhesive layer covering a second surface of the hole plate,
wherein the second surface of the hole plate includes a plurality of protrusions formed to correspond to an arrangement of micro-chips to be transferred by the micro-chip gripper, and
wherein the plurality of protrusions is configured to press the adhesive layer to the micro-chips when the pins are pushed into the hole plate.

2. The micro-chip gripper of claim 1 , wherein the plurality of holes of the hole plate are formed to correspond to the arrangement of micro-chips to be transferred by the micro-chip gripper.

3. The micro-chip gripper of claim 1 , wherein the plurality of holes of the hole plate is formed to correspond to positions of the protrusions, and
wherein each protrusion includes one or more of the plurality of holes.

4. The micro-chip gripper of claim 1 , wherein a pin length of the pins is longer than a distance from the second surface of the pin plate to the second surface of the hole plate, and
wherein each pin is longitudinally curved at a position corresponding to the space between the pin plate and the hole plate.

5. A micro-chip transfer apparatus comprising the micro-gripper of claim 1 .

6. The micro-chip transfer apparatus of claim 5 , wherein the plurality of holes of the hole plate are formed to correspond to an arrangement of microchips to be transferred by the micro-gripper.

7. The micro-chip transfer apparatus of claim 6 , wherein the plurality of holes of the hole plate is formed to correspond to positions of the protrusions, and
wherein each protrusion includes one or more holes of the plurality of holes.

8. The micro-chip transfer apparatus of claim 5 , wherein a pin length of the pins is longer than a distance from the second surface of the pin plate to the second surface of the hole plate, and
wherein each pin is longitudinally curved at a position corresponding to the space between the pin plate and the hole plate.

9. A transfer apparatus of electronic components comprising:
a plurality of pins;
a first plate connected to the plurality of pins to support the plurality of pins;
a second plate including a first surface opposite to a first surface of the first plate, and a second surface oriented in a direction opposite to the first surface thereof, and the second plate including a plurality of holes through which the plurality of pins are inserted and within which the pins are movable; and
a third plate having a first surface attached to the second surface of the second plate and including a plurality of holes through which the plurality of pins is inserted and within which the pins are movable,
wherein the third plate includes a polydimethylsiloxane (PDMS) layer,
wherein the third plate includes a plurality of protrusions formed to correspond to an arrangement of electronic components to be transferred, and
wherein the plurality of protrusions is configured to press the electronic components when the pins are pushed into the holes of the second plate and the third plate.

10. The transfer apparatus of claim 9 , wherein the respective pins move in accordance with movement of the first plate.

11. The transfer apparatus of claim 9 , wherein the second plate comprises at least one of metal, ceramic, or glass.

12. The transfer apparatus of claim 9 , wherein the plurality of holes of the third plate are formed laser beam irradiation.

13. The transfer apparatus of claim 9 , further comprising an additional plate including holes provided in correspondence with holes of the second plate,
wherein a diameter of each of the plurality of holes of the second plate is larger than a diameter of each of the plurality of holes of the additional plate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Changjoon
• Lee Byunghoon
• Park Min
• Jang Kyungwoon
• Yoon Jeonggen
• Jang Hyuntae

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/0446 Primary

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• H10H20/85

  Packages · CPC title

• B65G47/90

  Devices for picking-up and depositing articles or materials · CPC title

• B65G47/908

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