Electronic device comprising heat transfer portion

Patent metadata

Field	Value
Publication number	US-2026032802-A1
Application number	US-202519281194-A
Country	US
Kind code	A1
Filing date	Jul 25, 2025
Priority date	Jul 26, 2024
Publication date	Jan 29, 2026
Grant date	—

Abstract

An electronic device may include: a housing and a board assembly disposed inside the housing. The board assembly may include a printed circuit board having a first surface and a second surface, an electronic component disposed on the first surface of the board assembly, a shielding portion disposed on the first surface and surrounding the electronic component, the shielding portion including a first support portion forming a receiving space and a shielding sheet covering the receiving space, and a heat transfer portion disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, wherein the heat transfer portion may include a first base layer disposed on the electronic component, a coating layer disposed on the first base layer, a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer, and a second base layer disposed on the heat dissipating material.

First claim

What is claimed is:

1 . An electronic device comprising:
a housing; a board assembly disposed in the housing, comprising: a printed circuit board including a first surface and a second surface; an electronic component disposed on the first surface of the board assembly; a shielding portion disposed on the first surface and at least partially surrounding the electronic component, and including a first support portion defining a receiving space, and a shielding sheet at least partially covering the receiving space; and a heat transfer portion disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, wherein the heat transfer portion includes:
a first base layer disposed on the electronic component;
a coating layer disposed on the first base layer,
a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer; and
a second base layer disposed on the heat dissipation material.

2 . The electronic device of claim 1 , wherein the heat dissipating material is liquid at room temperature.

3 . The electronic device of claim 1 , wherein the first base layer and/or the second base layer are solid at room temperature.

4 . The electronic device of claim 1 , wherein the chemical bond between the coating layer and the heat dissipation material is a coordinative bond.

5 . The electronic device of claim 1 , wherein the coating layer is chemically bonded to at least one of the first base layer or the second base layer.

6 . The electronic device of claim 1 , wherein the chemical bond between the coating layer and at least one of the first base layer or the second base layer is a hydrogen bond.

7 . The electronic device of claim 1 , wherein the coating layer includes poly-dopamine.

8 . The electronic device of claim 1 , wherein the first base layer and/or the second base layer include paraffin wax.

9 . The electronic device of claim 1 ,
wherein the heat dissipation material includes a metal, and wherein the metal includes at least one of gallium (Ga), bismuth (Bi), indium (In), or tin (Sn).

10 . The electronic device of claim 1 , wherein the first base layer and/or the second base layer include an opening.

11 . The electronic device of claim 1 , wherein the first base layer and/or the second base layer further include an insertion portion inserted into the opening.

12 . The electronic device of claim 1 , wherein the first base layer and/or the second base layer further include at least one of ceramic, composite ceramic, carbon, or metal.

13 . The electronic device of claim 1 , wherein the heat dissipating material is disposed on a plurality of areas spaced apart on the coating layer.

14 . The electronic device of claim 1 , wherein the first base layer includes a recess formed in a portion thereof.

15 . The electronic device of claim 14 ,
wherein the coating layer is disposed on the recess, wherein the heat dissipating material is disposed on the coating layer.

16 . A heat transfer portion comprising:
a first base layer; a coating layer disposed on the first base layer; a heat dissipation material disposed on the coating layer and coordinatively bonded to the coating layer; and a second base layer disposed on the heat dissipation material.

17 . The heat transfer portion of claim 16 , wherein the heat dissipation material is liquid at room temperature.

18 . The heat transfer portion of claim 16 , wherein the coating layer is chemically bonded to at least one of the first base layer or the second base layer.

19 . A method of manufacturing a heat transfer portion, the method comprising:
manufacturing a first base layer; coating a coating layer on the first base layer; applying a liquid heat dissipation material to the coating layer; and laminating a second base layer to the heat dissipation material and the coating layer, wherein the coating layer and the heat dissipation material are coordinatively bonded.

20 . The method of claim 19 , wherein the coating layer is chemically bonded to at least one of the first base layer or the second base layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Min
• Chang Yoonhee
• HWANG Jieun
• Jung Jinhwan
• Son Jihyeon
• Yoon Jeonggen

Classifications

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K2201/06

  Thermal details · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title