Method for bonding of chips

Patent metadata

Field	Value
Publication number	US-12456720-B2
Application number	US-202418425205-A
Country	US
Kind code	B2
Filing date	Jan 29, 2024
Priority date	Mar 2, 2017
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

A method for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

First claim

What is claimed is:

1. A method operatively associated with a bond head of a bonding device for bonding chips onto at least one of a semiconductor substrate or onto further chips, the method comprising:
forming a liquid film on mounting points on the at least one of the semiconductor substrate or the further chips, the at least one of the semiconductor substrate or the further chips comprising a dielectric surface region and an electric surface region;
positioning hybrid bond surfaces of the chips at the mounting points on the at least one of the semiconductor substrate or the further chips, by the bond head of a bonding device, the hybrid bond surfaces comprising a dielectric surface region and an electric surface region;
using the bond head to directly bond the chips to the mounting points on the at least one of the semiconductor substrate or the further chips, wherein using the bond head to directly bond the chips comprises first bonding a center of the chips onto the liquid film and then bonding outwards from the center of the chips onto the liquid film while holding the chips by the bond head; and
releasing the chips from fixation by the bond head, wherein the electric surface region of the chips and the electric surface region of the at least one of the semiconductor substrate or the further chips self-align congruently with one another.

2. The method according to claim 1 , comprising prior to positioning the hybrid bond surfaces, fixing a substrate onto a carrier and subsequently separating the substrate into the chips.

3. The method according to claim 2 , comprising prior to fixing the substrate on the carrier, cleaning a bond surface of the substrate.

4. The method according to claim 3 , wherein cleaning comprises cleaning the bond surfaces of the chips as the chips are removed from the carrier and/or while transporting the chips to bond positions.

5. The method according to claim 3 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

6. The method according to claim 2 , wherein cleaning comprises cleaning the bond surfaces of the chips as the chips are removed from the carrier and/or while transporting the chips to bond positions.

7. The method according to claim 6 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

8. The method according to claim 2 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Wimplinger Markus

Classifications

• H10W80/00

  Direct bonding of chips, wafers or substrates · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W46/301

  for alignment · CPC title