Device and method for bonding substrates

Patent metadata

Field	Value
Publication number	US-11697281-B2
Application number	US-202117341509-A
Country	US
Kind code	B2
Filing date	Jun 8, 2021
Priority date	May 29, 2013
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

First claim

Having described the invention, the following is claimed:

1. A method for bonding a first substrate to a second substrate on respective contact surfaces of the substrates, the method comprising:
accommodating the first substrate on a first mounting surface of a first mounting apparatus and the second substrate on a second mounting surface of a second mounting apparatus, the second mounting apparatus comprising an opening, the opening having a nozzle configured to deform the second substrate by applying pressure thereto for alignment of the contact surfaces;
bringing the contact surface of the first substrate into contact with the contact surface of the second substrate at a bond initiation site; and
bonding the first substrate to the second substrate along a bonding wave which is traveling from the bond initiation site to side edges of the substrates,
wherein the first substrate and/or the second substrate is/are deformed for the alignment of the contact surfaces outside the bond initiation site before and/or during the bonding,
wherein a radii of curvature of the substrates deviates only marginally from each other at least in a region at which the contact surfaces are brought into contact at a bond front of the bonding wave.

2. The method as claimed in claim 1 , wherein the radii of curvature of the substrates deviate from each other at the bond front less than 5%.

3. The method as claimed in claim 1 , wherein the radii of curvature of the substrates are the same at the bond front.

4. The method as claimed in claim 1 , wherein the deformation of the first substrate and/or the second substrate depends on given factors that influence the traveling of the bonding wave.

5. The method as claimed in claim 1 , wherein the bond initiation site is located in a center of the contact surfaces.

6. The method as claimed in claim 1 , wherein the deformation of the first substrate and/or the second substrate takes place in a lateral direction, convexly, concavely, or a combination one or more thereof.

7. The method as claimed in claim 1 , wherein the deformation of the first substrate and/or the second substrate comprises one of expansion, compression, or curving the first substrate and/or the second substrate.

8. The method as claimed in claim 1 , wherein diameters of the substrates deviate from one another by less than 5 mm.

9. The method as claimed in claim 1 , wherein the deformation comprises mechanically actuating and/or controlling a temperature of the first and/or second mounting apparatus.

10. The method as claimed in claim 1 , wherein the first substrate and/or the second substrate are fixed solely in a region of the side edges on the first and/or second mounting surfaces.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Wagenleitner Thomas
• Wimplinger Markus
• Lindner Friedrich Paul
• Plach Thomas
• Kurz Florian

Classifications

• H01L21/187

  Electricity · mapped topic

• B32B38/1833 Primary

  Positioning, e.g. registration or centering · CPC title

• B32B2457/14

  Semiconductor wafers · CPC title

• B32B37/18

  involving the assembly of discrete sheets or panels only · CPC title

• B29C66/73141

  Electrical conductivity · CPC title