Electro-optical modulator using waveguides with overlapping ridges
US-12560831-B2 · Feb 24, 2026 · US
This page is not indexed by search engines while we improve data quality.
Webster Mark patents
Webster Mark is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Webster Mark |
| Total patents | 43 |
| First publication | Jan 8, 2015 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electro-optical modulator using waveguides with overlapping ridges
US-11886056-B2 · Jan 30, 2024 · US
Electro-optical modulator using waveguides with overlapping ridges
US-2022082875-A1 · Mar 17, 2022 · US
Electro-optical modulator using waveguides with overlapping ridges
US-11226505-B2 · Jan 18, 2022 · US
Photonic integration platform
US-11156783-B2 · Oct 26, 2021 · US
Electro-optical modulator using waveguides with overlapping ridges
US-2020183198-A1 · Jun 11, 2020 · US
Single facet laser sources
US-10608410-B2 · Mar 31, 2020 · US
Electro-optical modulator using waveguides with overlapping ridges
US-10598967-B2 · Mar 24, 2020 · US
Photonic integration platform
US-2020088946-A1 · Mar 19, 2020 · US
Photonic integration platform
US-10509174-B2 · Dec 17, 2019 · US
Recent patents
Latest publications not already listed above.
Photonic chip with an evanescent coupling interface
US-10481326-B2 · Nov 19, 2019 · US
Systems and methods for dynamic C# serialization
US-10467321-B2 · Nov 5, 2019 · US
Single facet laser sources
US-2019319427-A1 · Oct 17, 2019 · US
Silicon photonic hybrid polarization demultiplexer
US-10330960-B2 · Jun 25, 2019 · US
Single facet laser sources
US-10320151-B1 · Jun 11, 2019 · US
Systems and methods for dynamic c# serialization
US-2019073430-A1 · Mar 7, 2019 · US
Slotted configuration for optimized placement of micro-components using adhesive bonding
US-10175448-B2 · Jan 8, 2019 · US
Photonic integration platform
US-2018341064-A1 · Nov 29, 2018 · US
Photonic integration platform
US-10054745-B2 · Aug 21, 2018 · US
Photonic chip with an evanescent coupling interface
US-2018188450-A1 · Jul 5, 2018 · US
Photonic chip with an evanescent coupling interface
US-9933566-B2 · Apr 3, 2018 · US
Silicon photonic chip with through VIAS
US-9864133-B2 · Jan 9, 2018 · US
Silicon photonic hybrid polarization demultiplexer
US-2017336656-A1 · Nov 23, 2017 · US
Electro-optical modulator using waveguides with overlapping ridges
US-2017269393-A1 · Sep 21, 2017 · US
Electro-optical modulator using waveguides with overlapping ridges
US-9766484-B2 · Sep 19, 2017 · US
Silicon photonic hybrid polarization demultiplexer
US-9746700-B2 · Aug 29, 2017 · US
Photonic integration platform
US-2017192174-A1 · Jul 6, 2017 · US
Silicon photonic chip with through vias
US-2017139132-A1 · May 18, 2017 · US
Photonic chip with an evanescent coupling interface
US-2017139142-A1 · May 18, 2017 · US
Photonic integration platform
US-9651739-B2 · May 16, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Cisco Tech Inc | 40 |
| Mastercard International Inc | 2 |
| Harris Corp | 2 |
| Deutsche Post Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B6/132 | 19 |
| G02B6/1228 | 19 |
| G02B6/305 | 16 |
| G02B6/12002 | 16 |
| G02F1/025 | 13 |