Photonic integration platform

Patent metadata

Field	Value
Publication number	US-9651739-B2
Application number	US-201514946946-A
Country	US
Kind code	B2
Filing date	Nov 20, 2015
Priority date	Jul 3, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

First claim

We claim:

1. A silicon-on-insulator (SOI) optical device comprising:
a semiconductor substrate;
an insulation layer disposed above the substrate, wherein a waveguide is embedded in the insulation layer, and wherein the embedded waveguide comprises a waveguide adapter comprising multiple prongs exposed at an external coupling surface of the optical device, the external coupling surface being configured to couple to an external light source; and
a crystalline silicon layer above the insulation layer, the silicon layer comprising a silicon waveguide that overlaps the embedded waveguide such that an optical signal transmitted in the embedded waveguide is transferred to the silicon waveguide.

2. The SOI optical device of claim 1 , wherein at least a portion of the embedded waveguide and a portion of the silicon waveguide are tapered where the embedded and silicon waveguides overlap in the optical device.

3. The SOI optical device of claim 1 , wherein the waveguide adapter comprises a first prong that is disposed above a second prong in the insulation layer relative to the substrate, and wherein a dimension of the second prong decreases as the second prong extends away from the external coupling surface and a dimension of the first prong increases as the first prong extends away from the external coupling surface.

4. The SOI optical device of claim 1 , wherein the substrate comprises a groove configured to passively align the external light source at the external coupling surface to introduce light into the multiple prongs of the waveguide adapter.

5. The SOI optical device of claim 1 , wherein the embedded and silicon waveguides are spaced apart no more than 500 nanometers where the silicon and embedded waveguides overlap.

6. The SOI optical device of claim 1 , wherein the insulation layer is a silicon type insulator and the embedded waveguide comprises one of silicon oxynitride and silicon nitride.

7. A silicon-on-insulator (SOI) optical device comprising:
a semiconductor substrate;
an insulation layer disposed above the substrate, wherein a waveguide is embedded in the insulation layer, wherein the insulation layer completely surrounds the embedded waveguide, and wherein the embedded waveguide comprises a waveguide adapter comprising multiple prongs exposed at an external coupling surface of the optical device, the external coupling surface being configured to couple to an external light source; and
a crystalline silicon layer above the insulation layer, the silicon layer comprising a silicon waveguide that overlaps the embedded waveguide such that an optical signal transmitted in the embedded waveguide is transferred to the silicon waveguide.

8. The SOI optical device of claim 7 , wherein at least a portion of the embedded waveguide and a portion of the silicon waveguide are tapered where the embedded and silicon waveguides overlap in the optical device.

9. The SOI optical device of claim 7 , wherein the waveguide adapter comprises a first prong that is disposed above a second prong in the insulation layer relative to the substrate, and wherein a dimension of the second prong decreases as the second prong extends away from the external coupling surface and a dimension of the first prong increases as the first prong extends away from the external coupling surface.

10. The SOI optical device of claim 7 , wherein the substrate comprises a groove configured to passively align the external light source at the external coupling surface to introduce light into the multiple prongs of the waveguide adapter.

11. The SOI optical device of claim 7 , wherein the embedded and silicon waveguides are spaced apart no more than 500 nanometers where the silicon and embedded waveguides overlap.

12. The SOI optical device of claim 7 , wherein the insulation layer is a silicon type insulator and the embedded waveguide comprises one of silicon oxynitride and silicon nitride.

Assignees

• Cisco Tech Inc

Inventors

• Webster Mark
• Tummidi Ravi Sekhar

Classifications

• G02B6/30 Primary

  for use between fibre and thin-film device · CPC title

• G02B6/305 Primary

  and having an integrated mode-size expanding section, e.g. tapered waveguide · CPC title

• G02B2006/12061

  Silicon · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/14

  Mode converters · CPC title