Deposition of molybdenum
US-2026092369-A1 · Apr 2, 2026 · US
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Van Cleemput Patrick A patents
Van Cleemput Patrick A is listed as an inventor on 75 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Van Cleemput Patrick A |
| Total patents | 75 |
| First publication | Jan 1, 2015 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Deposition of molybdenum
US-12553131-B2 · Feb 17, 2026 · US
Integration of dry development and etch processes for euv patterning in a single process chamber
US-2026036908-A1 · Feb 5, 2026 · US
Integration of dry development and etch processes for EUV patterning in a single process chamber
US-12474640-B2 · Nov 18, 2025 · US
Molybdenum deposition
US-2025323046-A1 · Oct 16, 2025 · US
Integration of dry development and etch processes for euv patterning in a single process chamber
US-2025291255-A1 · Sep 18, 2025 · US
Molybdenum fill
US-2025285920-A1 · Sep 11, 2025 · US
Deposition of films using molybdenum precursors
US-12351914-B2 · Jul 8, 2025 · US
Molybdenum deposition
US-12334351-B2 · Jun 17, 2025 · US
Molybdenum fill
US-12327762-B2 · Jun 10, 2025 · US
Recent patents
Latest publications not already listed above.
Deposition of molybdenum
US-2025179635-A1 · Jun 5, 2025 · US
Molybdenum deposition
US-2025029840-A1 · Jan 23, 2025 · US
Metal deposition
US-12203168-B2 · Jan 21, 2025 · US
Method to create air gaps
US-2024429091-A1 · Dec 26, 2024 · US
Deposition of pure metal films
US-2024401196-A1 · Dec 5, 2024 · US
Deposition of tungsten on molybdenum templates
US-12148623-B2 · Nov 19, 2024 · US
Method to create air gaps
US-12112980-B2 · Oct 8, 2024 · US
Low resistivity films containing molybdenum
US-2024297075-A1 · Sep 5, 2024 · US
Molybdenum deposition
US-12074029-B2 · Aug 27, 2024 · US
Deposition of metal films
US-2024271281-A1 · Aug 15, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-12051589-B2 · Jul 30, 2024 · US
Atomic layer deposition of metal films
US-11970776-B2 · Apr 30, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-2024030031-A1 · Jan 25, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-11784047-B2 · Oct 10, 2023 · US
Self-limiting growth
US-2023290680-A1 · Sep 14, 2023 · US
Metal oxide diffusion barriers
US-2023260834-A1 · Aug 17, 2023 · US
Deposition of pure metal films
US-2022389579-A1 · Dec 8, 2022 · US
Molybdenum fill
US-2022375792-A1 · Nov 24, 2022 · US
Deposition of metal films
US-2022356579-A1 · Nov 10, 2022 · US
Molybdenum templates for tungsten
US-2022359211-A1 · Nov 10, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 75 |
| Lan Res Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/425 | 29 |
| C23C16/56 | 29 |
| H10P14/418 | 29 |
| H10P14/6336 | 28 |
| H10P14/432 | 28 |