Mounting base, substrate processing device, edge ring, and edge ring transfer method
US-2025329519-A1 · Oct 23, 2025 · US
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Uchida Yohei patents
Uchida Yohei is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Uchida Yohei |
| Total patents | 48 |
| First publication | Apr 23, 2015 |
| Latest publication | Oct 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Plasma processing apparatus and mounting table thereof
US-2025233008-A1 · Jul 17, 2025 · US
Plasma processing apparatus and mounting table thereof
US-12293937-B2 · May 6, 2025 · US
Foaming method
US-2025043188-A1 · Feb 6, 2025 · US
Electrostatic chuck, focus ring, support base, plasma processing apparatus, and plasma processing method
US-2024347322-A1 · Oct 17, 2024 · US
Electrostatic chuck, focus ring, support base, plasma processing apparatus, and plasma processing method
US-12046457-B2 · Jul 23, 2024 · US
Plasma processing apparatus
US-11984300-B2 · May 14, 2024 · US
Workpiece placement apparatus and processing apparatus
US-11942357-B2 · Mar 26, 2024 · US
Plasma processing apparatus and plasma processing method
US-11825589-B2 · Nov 21, 2023 · US
Polishing liquid composition for silicon oxide film
US-11795346-B2 · Oct 24, 2023 · US
Recent patents
Latest publications not already listed above.
Capillary guide device and wire bonding apparatus
US-11717912-B2 · Aug 8, 2023 · US
Focus ring
US-D992614-S · Jul 18, 2023 · US
Focus ring
US-D992615-S · Jul 18, 2023 · US
Substrate support, plasma processing apparatus, and focus ring
US-11600471-B2 · Mar 7, 2023 · US
Plasma processing apparatus and mounting table thereof
US-2023020793-A1 · Jan 19, 2023 · US
Plasma processing apparatus and mounting table thereof
US-11501995-B2 · Nov 15, 2022 · US
Plasma processing apparatus and plasma processing method
US-11495445-B2 · Nov 8, 2022 · US
Workpiece placement apparatus and processing apparatus
US-2022336257-A1 · Oct 20, 2022 · US
Workpiece placement apparatus and processing apparatus
US-11410871-B2 · Aug 9, 2022 · US
Capillary guide device and wire bonding apparatus
US-2022134468-A1 · May 5, 2022 · US
Electrostatic chuck, focus ring, support base, plasma processing apparatus, and plasma processing method
US-2021366694-A1 · Nov 25, 2021 · US
Mounting base, substrate processing device, edge ring, and edge ring transfer method
US-2021327688-A1 · Oct 21, 2021 · US
Plasma processing apparatus and plasma processing method
US-2021267042-A1 · Aug 26, 2021 · US
Plasma processing apparatus and plasma processing method
US-11032899-B2 · Jun 8, 2021 · US
Wire clamp apparatus calibration method and wire bonding apparatus
US-11004822-B2 · May 11, 2021 · US
Power feed structure and plasma processing apparatus
US-10886108-B2 · Jan 5, 2021 · US
Rinse agent composition for silicon wafers
US-10865368-B2 · Dec 15, 2020 · US
Polishing liquid composition for silicon oxide film
US-2020369919-A1 · Nov 26, 2020 · US
Plasma processing apparatus
US-2020373130-A1 · Nov 26, 2020 · US
Plasma processing apparatus and plasma processing method
US-10847348-B2 · Nov 24, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 37 |
| Kao Corp | 6 |
| Shinkawa Kk | 4 |
| Uchida Yohei | 2 |
| Masuda Takeshi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/32642 | 24 |
| H01J37/32715 | 22 |
| H10P72/722 | 18 |
| H10P50/242 | 17 |
| H10P72/7611 | 17 |