Workpiece placement apparatus and processing apparatus

Patent metadata

Field	Value
Publication number	US-11942357-B2
Application number	US-202217811121-A
Country	US
Kind code	B2
Filing date	Jul 7, 2022
Priority date	Mar 7, 2018
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.

First claim

What is claimed is:

1. A placement apparatus for placing a workpiece in a processing vessel, the placement apparatus comprising:
a stage on which the workpiece can be placed, the stage including an electrostatic chuck, the electrostatic chuck including a base member and a dielectric layer disposed on the base member;
an edge ring disposed on the stage so as to surround a periphery of the workpiece;
an electrically conductive connecting member provided around outer circumferences of the edge ring and the stage, an entirety of the electrically conductive connecting member being situated further out in a radial direction than an outermost circumference of the edge ring;
a first contacting member provided between the edge ring and the electrically conductive connecting member so as to be in contact with the electrically conductive connecting member and an outermost circumferential side surface of the edge ring; and
a second contacting member provided at a position lower than the first contacting member, so as to be in contact with the stage, the second contacting member being sandwiched in the radial direction between, and in contact with, the electrically conductive connecting member and the base member.

2. The placement apparatus according to claim 1 , wherein the first contacting member is a ring-shaped member and is provided at an entire circumference of the edge ring.

3. The placement apparatus according to claim 1 , wherein the second contacting member is formed of a plurality of members, each of the plurality of members being provided separately.

4. The placement apparatus according to claim 1 , wherein the first contacting member and the second contacting member are electrically connected with each other via at least one of the electrically conductive connecting member and the stage.

5. The placement apparatus according to claim 1 , wherein the electrically conductive connecting member is disposed at a recess provided at an insulator ring, the insulator ring being disposed around outer circumferential side surfaces of the edge ring and the stage; and
the first contacting member is disposed at a recess provided at the electrically conductive connecting member, so as to be in contact with the outermost circumference of the edge ring.

6. The placement apparatus according to claim 1 , wherein the first contacting member is an elastic, electrically conductive member.

7. The placement apparatus according to claim 1 , further including an insulating member separating the stage into an inner portion and an outer portion electrically, wherein the outer portion is configured such that direct current voltage is applied to the outer portion.

8. The placement apparatus according to claim 1 , wherein the first contacting member is disposed at a recess provided at the electrically conductive connecting member.

9. The placement apparatus according to claim 1 , wherein an outermost circumferential side surface of the base member has a recess formed therein, and the second contacting member is disposed in the recess.

10. A processing apparatus comprising:
a processing vessel including a processing space for applying a process to a workpiece; and
the placement apparatus according to claim 1 , the placement apparatus being provided in the processing vessel.

Assignees

• Tokyo Electron Ltd

Inventors

• Uchida Yohei
• Sugawa Naoki
• Abe Katsushi
• Hida Tsuyoshi

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P72/72

  using electrostatic chucks · CPC title