Chamferless via structures
US-10957588-B2 · Mar 23, 2021 · US
Trickett Douglas M is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Trickett Douglas M |
| Total patents | 19 |
| First publication | Feb 2, 2016 |
| Latest publication | Mar 23, 2021 |
Publications ranked by popularity score, then publication date.
US-10957588-B2 · Mar 23, 2021 · US
US-10937694-B2 · Mar 2, 2021 · US
US-10903118-B2 · Jan 26, 2021 · US
US-2019333814-A1 · Oct 31, 2019 · US
US-2019333813-A1 · Oct 31, 2019 · US
US-10388565-B2 · Aug 20, 2019 · US
US-2018269103-A1 · Sep 20, 2018 · US
US-10032668-B2 · Jul 24, 2018 · US
US-9799559-B1 · Oct 24, 2017 · US
US-9768113-B2 · Sep 19, 2017 · US
Latest publications not already listed above.
US-2017133268-A1 · May 11, 2017 · US
US-9613862-B2 · Apr 4, 2017 · US
US-2017062275-A1 · Mar 2, 2017 · US
US-2017062331-A1 · Mar 2, 2017 · US
US-2016379929-A1 · Dec 29, 2016 · US
US-9385078-B1 · Jul 5, 2016 · US
US-9373582-B1 · Jun 21, 2016 · US
US-9373543-B1 · Jun 21, 2016 · US
US-9252051-B1 · Feb 2, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 19 |
| Globalfoundries Inc | 12 |
| St Microelectronics Inc | 5 |
| Tokyo Electron Ltd | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/087 | 18 |
| H10W20/085 | 18 |
| H10W20/0693 | 17 |
| H10P50/73 | 17 |
| H10W20/081 | 17 |