Electronic component
US-12597554-B2 · Apr 7, 2026 · US
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Tomikawa Mitsuhiro patents
Tomikawa Mitsuhiro is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tomikawa Mitsuhiro |
| Total patents | 54 |
| First publication | Dec 1, 2015 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Interposer substrate and semiconductor package including interposer substrate
US-2026090388-A1 · Mar 26, 2026 · US
Electronic component and apparatus
US-12581743-B2 · Mar 17, 2026 · US
Electronic component embedded substrate and method of manufacturing the same
US-2026068699-A1 · Mar 5, 2026 · US
Thin film capacitor and electronic circuit board having the same
US-2025218659-A1 · Jul 3, 2025 · US
Thin film capacitor and electronic circuit board having the same
US-2025149252-A1 · May 8, 2025 · US
Electronic component embedded module and method of manufacturing electronic component embedded module
US-2025125226-A1 · Apr 17, 2025 · US
Thin film capacitor, manufacturing method therefor, and electronic circuit board having the thin film capacitor
US-2025120104-A1 · Apr 10, 2025 · US
Electronic component and apparatus
US-2024203972-A1 · Jun 20, 2024 · US
Electronic component and manufacturing method therefor
US-2023138154-A1 · May 4, 2023 · US
Recent patents
Latest publications not already listed above.
Electronic component
US-2023060995-A1 · Mar 2, 2023 · US
Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method
US-11581148-B2 · Feb 14, 2023 · US
Electronic component-incorporating substrate
US-11367626-B2 · Jun 21, 2022 · US
Electric component embedded structure
US-11335614-B2 · May 17, 2022 · US
Thin-film capacitor and method for manufacturing thin-film capacitor
US-11276531-B2 · Mar 15, 2022 · US
Thin-film capacitor
US-11114249-B2 · Sep 7, 2021 · US
Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method
US-2021257164-A1 · Aug 19, 2021 · US
Thin-film capacitor
US-10950389-B2 · Mar 16, 2021 · US
Electric component embedded structure
US-2021057296-A1 · Feb 25, 2021 · US
Electronic component mounting package
US-10886219-B2 · Jan 5, 2021 · US
Electronic component embedded substrate
US-10813220-B2 · Oct 20, 2020 · US
Thin-film capacitor and method for manufacturing thin-film capacitor
US-2020258690-A1 · Aug 13, 2020 · US
Electronic component-incorporating substrate
US-2020043751-A1 · Feb 6, 2020 · US
Thin-film capacitor
US-2020013554-A1 · Jan 9, 2020 · US
Electronic component housing package and electronic component housing method
US-2019394915-A1 · Dec 26, 2019 · US
Electronic component mounting package
US-2019378791-A1 · Dec 12, 2019 · US
Electronic component embedded substrate
US-10483345-B2 · Nov 19, 2019 · US
Thin-film capacitor
US-2019304701-A1 · Oct 3, 2019 · US
Thin-film capacitor
US-10340088-B2 · Jul 2, 2019 · US
Electronic component embedded substrate
US-10278290-B2 · Apr 30, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tdk Corp | 33 |
| Ibiden Co Ltd | 18 |
| Samsung Electronics Co Ltd | 3 |
| Furutani Toshiki | 1 |
| Mikado Yukinobu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/185 | 24 |
| H10W70/60 | 23 |
| H10W90/724 | 20 |
| H01G4/33 | 18 |
| H05K3/4697 | 18 |