Multilayer substrate and manufacturing method for the multilayer substrate
US-2015382464-A1 · Dec 31, 2015 · US
having cavities, e.g. for mounting components (H05K3/4691 takes precedence)
having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/4697 |
| Official title | {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} |
| Display label | having cavities, e.g. for mounting components (H05K3/4691 takes precedence) |
| Total patents | 1,315 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 94 |
| 2016 | 131 |
| 2017 | 128 |
| 2018 | 122 |
| 2019 | 105 |
| 2020 | 112 |
| 2021 | 130 |
| 2022 | 122 |
| 2023 | 140 |
| 2024 | 109 |
| 2025 | 98 |
| 2026 | 24 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wiring board and method for manufacturing the same
US-2015382471-A1 · Dec 31, 2015 · US
Printed wiring board
US-9226382-B2 · Dec 29, 2015 · US
Printed wiring board and method for manufacturing printed wiring board
US-2015366061-A1 · Dec 17, 2015 · US
Printed wiring board
US-2015366062-A1 · Dec 17, 2015 · US
Manufacturing method for camera module
US-2015358517-A1 · Dec 10, 2015 · US
Component-embedded board and method of manufacturing same
US-2015359103-A1 · Dec 10, 2015 · US
Package structure and method of manufacturing the same
US-2015359096-A1 · Dec 10, 2015 · US
Component built-in board and method of manufacturing the same, and mounting body
US-2015351218-A1 · Dec 3, 2015 · US
Printed circuit board, method for maufacturing the same and package on package having the same
US-2015342046-A1 · Nov 26, 2015 · US
Semi-Finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
US-2015334833-A1 · Nov 19, 2015 · US
Printed Circuit Board
US-2015334841-A1 · Nov 19, 2015 · US
Multi wireless charging apparatus and method for manufacturing the same
US-9178378-B2 · Nov 3, 2015 · US
Printed circuit boards including strip-line circuitry and methods of manufacturing same
US-9167683-B2 · Oct 20, 2015 · US
Circuit board, method for manufacturing circuit board, electronic component package, and method for manufacturing electronic component package
US-2015296620-A1 · Oct 15, 2015 · US
Multilayer wiring board with built-in electronic component and method for manufacturing the same
US-2015282305-A1 · Oct 1, 2015 · US
Communication module
US-2015282328-A1 · Oct 1, 2015 · US
Method of manufacturing circuit board and semiconductor package
US-2015262841-A1 · Sep 17, 2015 · US
Wiring substrate and method of making wiring substrate
US-2015257275-A1 · Sep 10, 2015 · US
Electronic device, electronic apparatus and moving object
US-2015255702-A1 · Sep 10, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/4697?
- CPC H05K3/4697 is the Cooperative Patent Classification code for “having cavities, e.g. for mounting components (H05K3/4691 takes precedence).”
- How many patents are filed under CPC H05K3/4697 (having cavities, e.g. for mounting components (H05K3/4691 takes precedence))?
- Our database includes 1,315 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/4697 growing?
- Publication counts under this code: 109 in 2024 vs 98 in 2025 (latest complete years).