Thin film electronic component
US-2016064473-A1 · Mar 3, 2016 · US
Electronic component embedded substrate
US10483345B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10483345-B2 |
| Application number | US-201815891637-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 8, 2018 |
| Priority date | Feb 13, 2017 |
| Publication date | Nov 19, 2019 |
| Grant date | Nov 19, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component embedded substrate comprising: a substrate configured to include an insulating layer and to have a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component embedded in the substrate and configured to have a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals, wherein the electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer, an insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals, the insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other, and the thermal expansion coefficient of the material of which the insulating member is formed is smaller than that of the material of which the insulating layer is formed, and is greater than that of a material of which the second terminals are formed. 2. The electronic component embedded substrate according to claim 1 , wherein: the insulating member is provided close to the second principal surface with respect to the second terminals. 3. The electronic component embedded substrate according to claim 2 , wherein: the substrate further includes a core embedded in the insulating layer; a through-hole passing from the first principal surface side to the second principal surface side is provided in the core; and the electronic component is disposed in the through-hole. 4. The electronic component embedded substrate according to claim 1 , wherein: the substrate further includes a core embedded in the insulating layer; a through-hole passing from the first principal surface side to the second principal surface side is provided in the core; and the electronic component is disposed in the through-hole.
Assignees
Inventors
Classifications
Interconnections or connectors in packages · CPC title
comprising multiple insulating layers · CPC title
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title
leading through the housing, i.e. lead-through · CPC title
Single unit multiple capacitors, e.g. dual capacitor in one coil · CPC title
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Frequently asked questions
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- What does patent US10483345B2 cover?
- An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals …
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification H01L28/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).