Thin-film capacitor and method for manufacturing thin-film capacitor

Patent metadata

Field	Value
Publication number	US-11276531-B2
Application number	US-201816617106-A
Country	US
Kind code	B2
Filing date	May 16, 2018
Priority date	May 31, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

First claim

The invention claimed is:

1. A thin-film capacitor comprising:
an insulating base member; and
a capacitance portion that is laminated on the insulating base member and has a plurality of internal electrode layers which are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers,
wherein a relative dielectric constant of the dielectric layers is 100 or higher, and
a modulus of elasticity of the insulating base member is within a range of 5 GPa to 25 GPa.

2. The thin-film capacitor according to claim 1 ,
wherein the dielectric layers are baked.

3. A method for manufacturing a thin-film capacitor comprising:
a laminating step of laminating a plurality of internal electrode layers and dielectric films sandwiched between the internal electrode layers on a support member and forming a laminate;
a baking step of baking the laminate and forming dielectric layers from the dielectric films;
a removing step of removing the support member from the laminate after the baking step; and
an insulating base member-forming step of forming an insulating base member on a surface of the laminate exposed through the removing step.

4. The method for manufacturing a thin-film capacitor according to claim 3 ,
wherein in the laminating step, a protective layer is provided between the support member and the internal electrode layer positioned closest to the support member side.

5. A thin-film capacitor comprising:
a capacitance portion that has a plurality of internal electrode layers and dielectric layers sandwiched between the internal electrode layers; and
a wiring portion that is laminated on the capacitance portion and has an insulating layer covering a wiring layer and the capacitance portion electrically connected to the internal electrode layers,
wherein a coefficient of thermal expansion of the insulating layer is higher than a coefficient of thermal expansion of the wiring layer and a coefficient of thermal expansion of the capacitance portion, and
wherein a thickness of the wiring layer is larger than a thickness of the capacitance portion.

6. The thin-film capacitor according to claim 5 ,
wherein the thickness of the wiring layer is within a range of 40% to 70% of a thickness of the wiring portion.

7. A thin-film capacitor comprising:
an insulating base member;
a capacitance portion that is laminated on the insulating base member and has a plurality of internal electrode layers which are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers; and
a wiring portion including a wiring layer electrically connected to the internal electrode layers and an insulating layer disposed on the capacitor portion and covering the capacitor portion, wherein the wiring layer and the insulating layer are disposed on the capacitor portion,
wherein a difference between a coefficient of thermal expansion of the insulating layer and a coefficient of thermal expansion of the insulating base member is within a range of −10 to +50.

8. The thin-film capacitor according to claim 7 ,
wherein the insulating layer and the insulating base member are formed of the same material.

9. The thin-film capacitor according to claim 1 ,
further comprising a protective layer between the insulating base member and the internal electrode layer located closest to the insulating base member among the plurality of internal electrode layers.

10. The thin-film capacitor according to claim 5 ,
wherein the capacitance portion is laminated on an insulating base member, and
further comprising a protective layer between the insulating base member and the internal electrode layer located closest to the insulating base member among the plurality of internal electrode layers.

11. The thin-film capacitor according to claim 7 ,
further comprising a protective layer between the insulating base member and the internal electrode layer located closest to the insulating base member among the plurality of internal electrode layers.

12. A thin-film capacitor comprising:
an insulating base member;
a capacitance portion that is laminated on the insulating base member and has a plurality of internal electrode layers which are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers; and
a wiring portion that is laminated on the capacitance portion and has an insulating layer covering a wiring layer and the capacitance portion electrically connected to the internal electrode layers,
wherein a relative dielectric constant of the dielectric layers is 100 or higher,
a modulus of elasticity of the insulating base member is within a range of 5 GPa to 25 GPa, and
a thickness of the wiring layer is within a range of 40% to 70% of a thickness of the wiring portion.

Assignees

• Tdk Corp

Inventors

• Tsunoda Koichi
• Yoshikawa Kazuhiro
• Tomikawa Mitsuhiro
• Yoshida Kenichi

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/33 Primary

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/008

  Selection of materials · CPC title