Thin-film capacitor

Patent metadata

Field	Value
Publication number	US-11114249-B2
Application number	US-201816483516-A
Country	US
Kind code	B2
Filing date	Feb 13, 2018
Priority date	Feb 21, 2017
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.

First claim

The invention claimed is:

1. A thin-film capacitor comprising:
a first electrode terminal disposed on one surface side of the thin-film capacitor and including a connection area configured for external electrical connection;
a capacitor portion partially formed on a side of the first electrode terminal opposite to the one surface side and having a stacked structure in which an electrode layer and a dielectric layer are stacked in the stacked structure;
an insulating layer covering a formation area and a non-formation area from the side of the first electrode terminal opposite to the one surface side, the capacitor portion being formed in the formation area, the capacitor portion not being formed in the non-formation area;
a plurality of second electrode terminals provided on the insulating layer; and
a plurality of via conductors formed to penetrate the insulating layer in a stacking direction of the capacitor portion and connecting each of the plurality of second electrode terminals to one of the first electrode terminal and the electrode layer of the capacitor portion,
wherein a thickness of the first electrode terminal is larger than a thickness of the capacitor portion.

2. The thin-film capacitor according to claim 1 , wherein the first electrode terminal includes a plurality of connection areas to be externally connected and a penetrating portion penetrating the first electrode terminal between adjacent connection areas to divide the adjacent connection areas.

3. The thin-film capacitor according to claim 1 , wherein a thickness of the insulating layer is larger than a thickness of the capacitor portion.

4. The thin-film capacitor according to claim 1 , wherein the thin-film capacitor is capable of having an electronic component mounted on the thin-film capacitor and is to be disposed on a wiring board supplying electric power to the electronic component,
wherein the plurality of second electrode terminals are connected to the electronic component mounted on the thin-film capacitor, and
wherein the first electrode terminal is connected to the wiring board.

5. The thin-film capacitor according to claim 1 , wherein the insulating layer includes a first insulating layer covering the formation area and a second insulating layer covering the non-formation area, and
wherein each via conductor includes a first wiring portion formed along a surface of the first insulating layer and coming into contact with the first electrode terminal or the electrode layer of the capacitor portion, and a second wiring portion formed on the second insulating layer along a surface of the second insulating layer and coming into contact with the first wiring portion and respective second electrode terminals.

Assignees

• Tdk Corp

Inventors

• Tsunoda Koichi
• Tomikawa Mitsuhiro
• Yoshikawa Kazuhiro
• Yoshida Kenichi

Classifications

• H01G4/12 Primary

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/33 Primary

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/306

  made by thin film techniques · CPC title