Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US-10988852-B2 · Apr 27, 2021 · US
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Thorseth Matthew patents
Thorseth Matthew is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Thorseth Matthew |
| Total patents | 14 |
| First publication | Feb 9, 2017 |
| Latest publication | Apr 27, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-10508349-B2 · Dec 17, 2019 · US
Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
US-10190228-B2 · Jan 29, 2019 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US-10100421-B2 · Oct 16, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
US-10104782-B2 · Oct 16, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-10006136-B2 · Jun 26, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US-9932684-B2 · Apr 3, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-2017370014-A1 · Dec 28, 2017 · US
Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
US-2017283970-A1 · Oct 5, 2017 · US
Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US-2017114469-A1 · Apr 27, 2017 · US
Recent patents
Latest publications not already listed above.
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US-2017037526-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-2017037528-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
US-2017042037-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US-2017037527-A1 · Feb 9, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Rohm & Haas Elect Mat | 14 |
| Dow Global Technologies Llc | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 14 |
| C25D3/38 | 14 |
| C25D5/022 | 12 |
| C25D7/00 | 12 |
| G03F7/0002 | 10 |