Device and method for machining a surface of a workpiece
US-2024075533-A1 · Mar 7, 2024 · US
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Thomas David C patents
Thomas David C is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Thomas David C |
| Total patents | 23 |
| First publication | Jan 22, 2015 |
| Latest publication | Mar 7, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus and method for forming and applying edge protectors
US-11505344-B2 · Nov 22, 2022 · US
Apparatus and method for forming and applying edge protectors
US-2018319520-A1 · Nov 8, 2018 · US
Apparatus and method for forming and applying edge protectors
US-10099808-B2 · Oct 16, 2018 · US
Semiconductor device with metal extrusion formation
US-9825120-B2 · Nov 21, 2017 · US
Semiconductor device with metal extrusion formation
US-9825119-B2 · Nov 21, 2017 · US
Tsv wafer with improved fracture strength
US-9607929-B2 · Mar 28, 2017 · US
Semiconductor device with metal extrusion formation
US-9548349-B2 · Jan 17, 2017 · US
Semiconductor device with metal extrusion formation
US-2016343797-A1 · Nov 24, 2016 · US
Semiconductor device with metal extrusion formation
US-2016343798-A1 · Nov 24, 2016 · US
Recent patents
Latest publications not already listed above.
Controlled metal extrusion opening in semiconductor structure and method of forming
US-9484301-B2 · Nov 1, 2016 · US
Apparatus and method for forming and applying edge protectors
US-2016152363-A1 · Jun 2, 2016 · US
Methods of forming a TSV wafer with improved fracture strength
US-9312205-B2 · Apr 12, 2016 · US
Uniform roughness on backside of a wafer
US-9275868-B2 · Mar 1, 2016 · US
Semiconductor device with metal extrusion formation
US-2015380478-A1 · Dec 31, 2015 · US
Tsv wafer with improved fracture strength
US-2015348876-A1 · Dec 3, 2015 · US
Controlled metal extrusion opening in semiconductor structure and method of forming
US-2015255395-A1 · Sep 10, 2015 · US
Tsv wafer fracture strength
US-2015255404-A1 · Sep 10, 2015 · US
Semiconductor structures with metal lines
US-9087839-B2 · Jul 21, 2015 · US
Controlled metal extrusion opening in semiconductor structure and method of forming
US-9059258-B2 · Jun 16, 2015 · US
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
US-9006703-B2 · Apr 14, 2015 · US
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
US-2015035117-A1 · Feb 5, 2015 · US
Uniform roughness on backside of a wafer
US-2015021743-A1 · Jan 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 17 |
| Signode Ind Group Llc | 4 |
| Globalfoundries Inc | 2 |
| Skf Ab | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/425 | 8 |
| H10W20/056 | 7 |
| H10P50/73 | 6 |
| H10P50/71 | 6 |
| H10W20/0698 | 6 |