Semiconductor Device and Connecting Method
US-2026060098-A1 · Feb 26, 2026 · US
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Tatsumi Kohei patents
Tatsumi Kohei is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tatsumi Kohei |
| Total patents | 15 |
| First publication | Jun 16, 2015 |
| Latest publication | Feb 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Joining structure and manufacturing method for same
US-2024165921-A1 · May 23, 2024 · US
Solar battery module and method for manufacturing same
US-2024128391-A1 · Apr 18, 2024 · US
Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent
US-11810885-B2 · Nov 7, 2023 · US
Power semiconductor module device
US-11152286-B2 · Oct 19, 2021 · US
Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent
US-2021225794-A1 · Jul 22, 2021 · US
Electrode connection structure, lead frame, and method for forming electrode connection structure
US-10903146-B2 · Jan 26, 2021 · US
Semiconductor device
US-2019229103-A1 · Jul 25, 2019 · US
Power semiconductor module device and power semiconductor module manufacturing method
US-2019198428-A1 · Jun 27, 2019 · US
Electrode connection structure, lead frame, and method for forming electrode connection structure
US-2019103341-A1 · Apr 4, 2019 · US
Recent patents
Latest publications not already listed above.
Metal joining structure using metal nanoparticles and metal joining method and metal joining material
US-9960140-B2 · May 1, 2018 · US
Electrode connection structure and electrode connection method
US-9601448-B2 · Mar 21, 2017 · US
Metal joining structure using metal nanoparticles and metal joining method and metal joining material
US-2016240505-A1 · Aug 18, 2016 · US
Electrode connection structure and electrode connection method
US-2016225730-A1 · Aug 4, 2016 · US
Power semiconductor device, method of manufacturing the device and bonding wire
US-9059003-B2 · Jun 16, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Waseda | 15 |
| Mitsui High Tec | 3 |
| Nippon Steel & Sumitomo Metal Corp | 2 |
| Toyota Motor Co Ltd | 1 |
| Nippon Micrometal Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/736 | 9 |
| H10W72/952 | 8 |
| H10W72/352 | 8 |
| H10W72/59 | 8 |
| H10W72/90 | 7 |