Electrode connection structure, lead frame, and method for forming electrode connection structure

Patent metadata

Field	Value
Publication number	US-10903146-B2
Application number	US-201716083389-A
Country	US
Kind code	B2
Filing date	Mar 7, 2017
Priority date	Mar 10, 2016
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

[Solution] An electrode connection structure in which a semiconductor chip 12 electrode and/or a substrate electrode is connected to a plurality of elongated leads 11 of a lead frame 10 by plating. The plurality of elongated leads 11 of the lead frame 10 are arranged in parallel, and a longitudinal side surface of each lead 11 is connected to the semiconductor chip 12 electrode and/or the substrate electrode by plating. At a connection portion of a first connection surface 13 of the semiconductor chip 12 electrode and/or the substrate electrode, the first connection surface 13 being connected to the leads 11, and a second connection surface 14 in the longitudinal side surface of each lead 11, the second connection surface 14 being connected to the first connection surface 13, a distance between the first connection surface 13 and the second connection surface 14 continuously increases from an edge portion 15 of the second connection surface 14, the edge portion 15 being in contact with the first connection surface 13, toward an outer portion 16 of the second connection surface 14.

First claim

The invention claimed is:

1. A lead frame connectable to an electrode of an electronic device or a substrate by plating, the lead frame comprising:
a plurality of leads,
wherein each of the leads:
is elongated,
is arranged in parallel with others of the leads,
comprises a connection surface that is connected, by the plating, to the electrode in a manner that causes an edge portion of the connection surface to be in direct physical contact with the electrode, and
is reduced in thickness continuously from the edge portion toward
(1) an outer portion of the connection surface in a width direction of the leads, or
(2) a center portion between the edge portion and another edge portion adjacent to the edge portion in a longitudinal direction of the leads.

2. The lead frame according to claim 1 , wherein:
the edge portion is formed at a center portion of the connection surface in a longitudinal direction.

3. The lead frame according to claim 1 , wherein:
the edge portion comprises a plurality of transverse edge portions that are formed at a predetermined interval in a transverse direction of the connection surface, and a transverse concave groove-like gap is formed between each pair of adjacent transverse edge portions, the transverse gap penetrating in a transverse direction of the connection surface, wherein each of the leads is reduced in thickness from one of the pair of the adjacent transverse edge portions toward the center portion between the pair of the adjacent transverse edge portions.

4. The lead frame according to claim 1 , wherein:
a longitudinal concave groove-like gap that is continuous or discontinuous in a longitudinal direction of the connection surface is formed.

5. The lead frame according to claim 1 , wherein:
another edge portion is formed on a back surface side opposite to the connection surface.

6. The lead frame according to claim 1 , wherein:
the edge portion is formed at an angle of 3 to 15 degrees with respect to a surface of the electrode configured to be joined to the edge portion.

Assignees

• Univ Waseda
• Mitsui High Tec

Inventors

• Tatsumi Kohei
• Ueda Kazutoshi
• Sato Nobuaki
• Shimizu Koji

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/533

  Cross-sectional shape · CPC title

• H10W72/531

  Shapes of wire connectors · CPC title