Joining structure and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-2024165921-A1
Application number	US-202218547965-A
Country	US
Kind code	A1
Filing date	Feb 28, 2022
Priority date	Mar 1, 2021
Publication date	May 23, 2024
Grant date	—

Abstract

Provided is a joining structure in which two joined bodies composed of metal are firmly joined together with plated metal, and a method for manufacturing the joining structure. The joining structure comprises a first joined body composed of a first metal, a second joined body composed of a second metal, and a plating portion, disposed between the first joined body and the second joined body, formed of a plating metal, and joining the first joined body and the second joined body. In the plating portion a joining interface of plating metal is formed at around equidistance from the respective joined surfaces of the first joined body and the second joined body, and the plating portion comprises, in the vicinity of the joining interface, has a recrystallization region where the plating metal has recrystallized, or a first diffusion region where the plating metal has diffused.

First claim

1 . A joining structure, comprising:
a first joined body composed of a first metal, a second joined body composed of a second metal, and a plating portion, disposed between the first and second joined bodies, formed of a plating metal, and joining the first and second joined bodies, wherein in the plating portion, a joining interface of integrated plating metal is formed at around equidistance from the respective joined surfaces of the first and second joined bodies, and the plating portion comprises, in the vicinity of the joining interface, a recrystallization region where the plating metal has recrystallized or a first diffusion region where the plating metal has diffused.

2 . A joining structure, comprising:
a first joined body made of a first metal, a second joined body made of a second metal, a plating portion, disposed between the first and second joined bodies, formed of a plating metal, and joining the first and second joined bodies, and a second diffusion region where the metal of at least one of the first and second joined bodies and the plating metal are mixed and diffused, at the boundary between at least one of the first and second joined bodies and the plating portion.

3 . The joining structure according to claim 2 , wherein the plating portion has a recrystallized region of recrystallized plating metal at around equidistance from the respective surfaces of the first and second joined bodies.

4 . The joining structure according to claim 1 , wherein the first and second joined bodies make a point or linear contact, or are in close proximity in a point or linear manner.

5 . The joining structure according to claim 1 , wherein the first and second metals of the first and second joined bodies and the plating metal are identical or all proportional solid solution.

6 . The joining structure according to claim 1 , wherein the first and second joined bodies are composed of iron alloy, and the plating metal is composed of nickel or nickel alloy.

7 . A method of manufacturing a joining structure, comprising:
a connection step for connecting a first joined body and a second joined body with a plating metal by way of immersing a plating solution between the first joined body of first metal and the second joined body of second metal, thereby forming a joining interface of integrated plating metal grown from the respective joined surfaces of the first and second joined bodies, and a heat-treatment step for heat-treating the plating metal after the connection step, wherein, in the heat-treatment step, a recrystallization region is formed at the joining interface where the plating metal is recrystallized.

8 . A method of manufacturing a joining structure, comprising:
a connection step for connecting a first joined body and a second joined body with a plating metal by way of immersing a plating solution between the first joined body of first metal and the second joined body of second metal, thereby forming a joining interface of integrated plating metal grown from the respective joined surfaces of the first and second joined bodies, and a heat-treatment step for heat-treating the plating metal after the connection step, wherein, the heat-treatment temperature T2 in the heat-treatment step satisfies the relation of T2≥T1×⅓ (T1: melting temperature of the plating metal, T1 and T2 are of Kelvin).

9 . The method of manufacturing a joining structure according to claim 7 , wherein the joining interface disappears in the heat-treatment step.

10 . The method of manufacturing a joining structure according to claim 7 , wherein in the connection step, the respective joined surfaces of the first and second joined bodies partially make a point or linear contact, or are in close proximity in a point or linear manner, and the joining interface is formed in order from narrow sites to broad sites of the interspace between the respective joined surfaces of the first and second joined bodies.

11 . The method of manufacturing a joining structure according to claim 7 , wherein a smoothening step is carried out, prior to the connection step, for smoothening the respective joined surfaces of the first and second joined bodies.

12 . The joining structure according to claim 2 , wherein the first and second joined bodies are composed of iron alloy, and the plating metal is composed of nickel or nickel alloy.

13 . The method of manufacturing a joining structure according to claim 8 , wherein the joining interface disappears in the heat-treatment step.

Assignees

• Univ Waseda

Inventors

• Tatsumi Kohei

Classifications

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• B23K20/227

  with ferrous layer · CPC title

• B23K20/026

  with diffusion of soldering material · CPC title

• B32B15/015 Primary

  the said other metal being copper or nickel or an alloy thereof · CPC title

• B23K20/02

  by means of a press {; Diffusion bonding} · CPC title