Method of producing semiconductor device
US-12593534-B2 · Mar 31, 2026 · US
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Tamemoto Hiroaki patents
Tamemoto Hiroaki is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tamemoto Hiroaki |
| Total patents | 39 |
| First publication | Mar 5, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Laser adjustment method and laser machining device
US-2025229363-A1 · Jul 17, 2025 · US
Method for producing resin part
US-12319007-B2 · Jun 3, 2025 · US
Laser processing device, and method for manufacturing chip
US-12233481-B2 · Feb 25, 2025 · US
Plant conveyance and irradiation apparatus
US-12213417-B2 · Feb 4, 2025 · US
Method of manufacturing optical member, and light emitting device
US-2025040322-A1 · Jan 30, 2025 · US
Method for transferring light-emitting element and method for manufacturing light-emitting device
US-2024405155-A1 · Dec 5, 2024 · US
Resin component and manufacturing method thereof
US-2024336014-A1 · Oct 10, 2024 · US
Method of manufacturing semiconductor element
US-2024258170-A1 · Aug 1, 2024 · US
Resin member machining method, resin member machining apparatus, and resin component manufacturing method
US-11945173-B2 · Apr 2, 2024 · US
Recent patents
Latest publications not already listed above.
Method for producing resin part
US-2024001622-A1 · Jan 4, 2024 · US
Method of producing semiconductor device
US-2023387344-A1 · Nov 30, 2023 · US
Method of cutting a substrate along dividing lines
US-11769852-B2 · Sep 26, 2023 · US
Method for manufacturing light-emitting element
US-2023138592-A1 · May 4, 2023 · US
Laser processing device, and method for manufacturing chip
US-2022371130-A1 · Nov 24, 2022 · US
Plant treatment apparatus
US-2022354063-A1 · Nov 10, 2022 · US
Method of manufacturing light emitting element
US-11489086-B2 · Nov 1, 2022 · US
Resin member machining method, resin member machining apparatus, and resin component manufacturing method
US-2022324180-A1 · Oct 13, 2022 · US
Method for producing semiconductor light emitting element
US-11289621-B2 · Mar 29, 2022 · US
Method of manufacturing light emitting element
US-2021036182-A1 · Feb 4, 2021 · US
Method of manufacturing light emitting element
US-2021005777-A1 · Jan 7, 2021 · US
Method for producing semiconductor light emitting element
US-2020365758-A1 · Nov 19, 2020 · US
Method of manufacturing semiconductor element
US-10672660-B2 · Jun 2, 2020 · US
Method for manufacturing semiconductor element by dividing semiconductor wafer using pressing member having tip portion
US-10388827-B2 · Aug 20, 2019 · US
Method for manufacturing semiconductor element of polygon shape
US-2019035973-A1 · Jan 31, 2019 · US
Method for manufacturing semiconductor element of polygon shape
US-10115857-B2 · Oct 30, 2018 · US
Method for manufacturing light emitting element
US-10084108-B2 · Sep 25, 2018 · US
Method of manufacturing semiconductor element
US-2018247871-A1 · Aug 30, 2018 · US
Method for manufacturing light emitting element
US-2017200855-A1 · Jul 13, 2017 · US
Method for manufacturing semiconductor element
US-9653644-B2 · May 16, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nichia Corp | 39 |
| Laser Systems Inc | 5 |
| Hamamatsu Photonics Kk | 4 |
| Imra America Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10H20/01 | 27 |
| H01L33/0095 | 22 |
| H10H20/819 | 12 |
| H10P54/00 | 12 |
| H10H20/825 | 10 |