Method of cutting a substrate along dividing lines

Patent metadata

Field	Value
Publication number	US-11769852-B2
Application number	US-202016945729-A
Country	US
Kind code	B2
Filing date	Jul 31, 2020
Priority date	Aug 2, 2019
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.

First claim

What is claimed is:

1. A method of manufacturing a light emitting element, the method comprising:
scanning and irradiating a laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and
scanning and irradiating a laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions;
wherein the step of creating first modified regions comprises:
a step of first irradiating a laser light successively to all of the predetermined dividing lines extending in a first direction in parallel to first opposite sides which are opposite sides of each of the plurality of hexagonal shapes;
a step of second irradiating a laser light successively to all of the predetermined dividing lines extending in a second direction in parallel to second opposite sides which are opposite sides different from the first opposite sides of each of the plurality of hexagonal shapes; and
a step of third irradiating a laser light successively to all of the predetermined dividing lines extending in a third direction in parallel to third opposite sides which are opposite sides different from the first opposite sides and the second opposite sides of each of the plurality of hexagonal shapes, and
wherein the step of first irradiating a laser light comprises:

a step of first scanning and irradiating in which a laser light is caused to scan along the first direction and irradiated to a plurality of segments of first predetermined dividing lines located on a single straight line extending in the first direction; and
a first repeating step in which a target position of the laser light is parallelly shifted by half a distance between the first opposite sides and repeats the first scanning and irradiating;
the step of second irradiating a laser light comprises:
a step of second scanning and irradiating in which a laser light is caused to scan along the second direction and irradiated to a plurality of segments of second predetermined dividing lines located on a single straight line extending in the second direction; and
a second repeating step in which a target position of the laser light is parallelly shifted by half a distance between the second opposite sides and repeats the second scanning and irradiating; and
the step of third irradiating a laser light comprises:
a step of third scanning and irradiating in which a laser light is caused to scan along the third direction and irradiated to a plurality of segments of third predetermined dividing lines located on a single straight line extending in the third direction; and
a third repeating step in which a target position of the laser light is parallelly shifted by half a distance between the third opposite sides and repeats the third scanning and irradiating.

2. The method of manufacturing a light emitting element according to claim 1 , wherein an extending direction of each side of each of the plurality of hexagonal shapes intersects with a cleavage plane of the sapphire substrate.

3. The method of manufacturing a light emitting element according to claim 2 , wherein
the step of first irradiating a laser light comprises:
a step of first scanning and irradiating in which a laser light is caused to scan along the first direction and irradiated to a plurality of segments of first predetermined dividing lines located on a single straight line extending in the first direction; and
a first repeating step in which a target position of the laser light is parallelly shifted by half a distance between the first opposite sides and repeats the first scanning and irradiating;
the step of second irradiating a laser light comprises:
a step of second scanning and irradiating in which a laser light is caused to scan along the second direction and irradiated to a plurality of segments of second predetermined dividing lines located on a single straight line extending in the second direction; and
a second repeating step in which a target position of the laser light is parallelly shifted by half a distance between the second opposite sides and repeats the second scanning and irradiating; and
the step of third irradiating a laser light comprises:
a step of third scanning and irradiating in which a laser light is caused to scan along the third direction and irradiated to a plurality of segments of third predetermined dividing lines located on a single straight line extending in the third direction; and
a third repeating step in which a target position of the laser light is parallelly shifted by half a distance between the third opposite sides and repeats the third scanning and irradiating.

4. The method of manufacturing a light emitting element according to claim 3 , wherein the pitch of the pulsed laser in the step of creating first modified regions is in a range of 1 to 6 μm, and the pitch of the pulsed laser in the step of creating second modified regions is in a range of 2 to 10 μm.

5. The method of manufacturing a light emitting element according to claim 4 , wherein the first irradiation intensity in the step of creating first modified regions is in a range of 0.6 to 10.0 μJ, and the second irradiation intensity in the step of creating second modified regions is in a range of 0.7 to 30.0 μJ.

6. The method of manufacturing a light emitting element according to claim 3 , wherein the first irradiation intensity in the step of creating first modified regions is in a range of 0.6 to 10.0 μJ, and the second irradiation intensity in the step of creating second modified regions is in a range of 0.7 to 30.0 μJ.

7. The method of manufacturing a light emitting element according to claim 1 , wherein the laser light is a pulsed laser, and the laser light is irradiated on the predetermined dividing lines at predetermined pitches respectively in the step of creating first modified regions and in the step of creating second modified regions;
in the step of creating first modified regions, a distance between an end of a single segment of the predetermined dividing lines and a start point of laser irradiation is greater than the pitch in the step of creating first modified regions, and a distance between another end of the single segment of the predetermined dividing lines and a stop point of laser irradiation is greater than the pitch in the step of creating first modified regions; and
in the step of creating second modified regions, a distance between an end of a single segment of the predetermined dividing lines and a start point of laser irradiation is greater than the pitch in the step of creating second modified regions and, a distance between another end of the single segment of the predetermined dividing lines and a stop point of laser irradiation is greater than the pitch in the step of creating second modified regions.

8. The method of manufacturing a light emitting element according to claim 1 , wherein the laser light in the step of creating first modified regions is a pulsed laser, the laser light in the step of creating second modified regions is a pulsed laser, the laser light is irradiated on the predetermined dividing lines at predetermined pitches in the step of creating first modified regions, and the laser light is irradiated on the predetermined dividing lines at predetermined pitches in the step of creating second modified regions; and
wherein the pitch in the step of creating first modified regions is smaller than the pitch in

Assignees

• Nichia Corp

Inventors

• Ibaraki Masayuki
• Yamamoto Minoru
• Inoue Naoto
• Tamemoto Hiroaki

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/819

  characterised by their shape, e.g. curved or truncated substrates · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title

• H01L33/0095 Primary

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic