Resin member machining method, resin member machining apparatus, and resin component manufacturing method

Patent metadata

Field	Value
Publication number	US-11945173-B2
Application number	US-202217847928-A
Country	US
Kind code	B2
Filing date	Jun 23, 2022
Priority date	Dec 27, 2019
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

First claim

The invention claimed is:

1. A method for processing a resin member, the method comprising:
irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is 375 nm or greater and 410 nm or less; and
irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength, wherein a wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

2. The method according to claim 1 , further comprising:
providing a second member; and
joining the first member and the second member by bringing the second member and a region of the first member irradiated with the first light and the second light into contact with each other.

3. The method according to claim 2 , wherein the step of irradiating with the second light and the step of joining the first member and the second member are simultaneously performed.

4. The method according to claim 2 , wherein the wavelength range of the second wavelength is a wavelength range in which the light absorption of the resin increases due to temperature rise of the resin due to electronic excitation of the resin.

5. The method according to claim 2 , wherein the wavelength range of the second wavelength is a wavelength range in which the light absorption of the resin increases due to an excited triplet state of the resin due to electronic excitation of the resin.

6. The method according to claim 2 , wherein, in a state in which the resin has not been irradiated with the first light, the resin does not have absorption through electronic excitation for light of the second wavelength.

7. The method according to claim 2 , wherein the step of irradiating with the first light and the step of irradiating with the second light are simultaneously performed.

8. The method according to claim 2 , wherein the first light and the second light are laser light.

9. The method according to claim 2 , wherein the second wavelength is greater than 400 nm and equal to or less than 550 nm.

10. The method according to claim 1 , wherein the second wavelength is greater than 400 um and equal to or less than 550 um.

11. The method according to claim 10 , wherein, in the step of irradiating with the first light and the step of irradiating with the second light, a temperature of a region irradiated with the first light and the second light in the first member is measured, and an intensity of the first light and an intensity of the second light are adjusted in accordance with the temperature of the region of the first member that is irradiated with the first light and the second light.

12. A processing apparatus for a resin member, the processing apparatus comprising:
a first light irradiation system configured to irradiate a resin of a first member with a first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is 375 nm or greater and 410 nm or less; and
a second light irradiation system configured to irradiate the resin of the first member with second light of a second wavelength longer than the first wavelength, wherein a wavelength range of the second wavelength is within a wavelength range in which a light absorption of the resin increases through electronic excitation of the resin.

13. The processing apparatus according to claim 12 , further comprising:
a position control unit configured to control a relative position of the first member and a second member, wherein:
the position control unit is configured to join the second member and the first member irradiated with the first light and the second light from the first light irradiation system and the second light irradiation system.

14. The processing apparatus according to claim 13 , wherein the wavelength range of the second wavelength is a wavelength range in which the light absorption of the resin increases clue to temperature rise of the resin clue to electronic excitation of the resin.

15. The processing apparatus according to claim 13 , wherein the wavelength range of the second wavelength is a wavelength range in which the light absorption of the resin increases due to excited triplet state of the resin due to electronic excitation of the resin.

16. The processing apparatus according to claim 13 , wherein the first light irradiation system and the second light irradiation system are configured to simultaneously perform irradiation with the first light and irradiation with the second light.

17. The processing apparatus according to claim 13 , wherein the first light irradiation system and the second light irradiation system are configured to emit laser light.

18. The processing apparatus according to claim 13 , wherein the second wavelength is greater than 400 nm and equal to or less than 550 nm.

19. The processing apparatus according to claim 12 , wherein the first light irradiation system and the second light irradiation system are configured to irradiate an interface of the first member and a second member in a state in which the first member and the second member are disposed in contact with each other.

20. The processing apparatus according to claim 12 , wherein the second wavelength is greater than 400 nm and equal to or less than 550 nm.

21. The processing apparatus according to claim 12 , further comprising:
a temperature measurement unit; and
a light quantity control unit; wherein:
the temperature measurement unit is configured to measure a temperature of a region of the first member irradiated with the first light and the second light; and
the light quantity control unit is configured to adjust an intensity of the first light and the second light in accordance with the temperature measured by the temperature measurement unit.

22. A method for processing a resin component, the method comprising:
irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin, wherein the first wavelength is equal to or greater than 375 nm and equal to or less than 410 nm; and
irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength, wherein the second wavelength is greater than 400 nm and equal to or less than 550 nm, wherein:
a power output of the first light is smaller than a power output of the second light.

23. The method according to claim 22 , further comprising:
providing a second member; and
joining the first member and the second member by bringing the second member and a region of the first member irradiated with the first light and the second light into contact with each other.

24. The method according to claim 23 , wherein the step of irradiating with the second light and the step of joining the first member and the second member are simultaneously performed.

25. The method according to claim 23 , wherein the wavelength range of the second wavelength is a wavelength range in which the light absorption of the resin increases due to temperature rise of the resin due to electronic excitation of the resin.

Assignees

• Laser Systems Inc
• Nichia Corp

Inventors

• Asakawa Yuichi
• Tsuboi Yasuyuki
• Tamemoto Hiroaki
• Taoka Ryota
• Yamamoto Minoru

Classifications

• B29C65/1609 Primary

  Visible light radiation, e.g. by visible light lasers · CPC title

• B29C66/91221

  of the parts to be joined · CPC title

• B29C66/952

  by measuring or controlling the wavelength · CPC title

• B29C66/41 Primary

  Joining substantially flat articles (B29C66/47 and subgroups take precedence); Making flat seams in tubular or hollow articles (B29C66/51 and subgroups take precedence) · CPC title

• B29C66/1122

  Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title