Method of manufacturing a chip structure and chip structure
US-2025125304-A1 · Apr 17, 2025 · US
This page is not indexed by search engines while we improve data quality.
Strobel Peter patents
Strobel Peter is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Strobel Peter |
| Total patents | 16 |
| First publication | Jul 9, 2015 |
| Latest publication | Apr 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Package with separate substrate sections
US-11710684-B2 · Jul 25, 2023 · US
Processing of one or more carrier bodies and electronic components by multiple alignment
US-11502042-B2 · Nov 15, 2022 · US
Die attach methods and semiconductor devices manufactured based on such methods
US-11296015-B2 · Apr 5, 2022 · US
Package with separate substrate sections
US-2021111108-A1 · Apr 15, 2021 · US
Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods
US-2021013132-A1 · Jan 14, 2021 · US
Processing of one or more carrier bodies and electronic components by multiple alignment
US-2021005557-A1 · Jan 7, 2021 · US
Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier
US-2020395334-A1 · Dec 17, 2020 · US
Die attach methods and semiconductor devices manufactured based on such methods
US-10832992-B2 · Nov 10, 2020 · US
Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods
US-2019348347-A1 · Nov 14, 2019 · US
Recent patents
Latest publications not already listed above.
Die attach methods and semiconductor devices manufactured based on such methods
US-10396015-B2 · Aug 27, 2019 · US
Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods
US-2018040530-A1 · Feb 8, 2018 · US
Batch process for connecting chips to a carrier
US-9673170-B2 · Jun 6, 2017 · US
Chip arrangement and method of manufacturing the same
US-9349680-B2 · May 24, 2016 · US
Batch Process for Connecting Chips to a Carrier
US-2016043054-A1 · Feb 11, 2016 · US
Chip arrangement and method of manufacturing the same
US-2015194377-A1 · Jul 9, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 14 |
| Infineon Technologies Austria | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/073 | 14 |
| H10W90/736 | 13 |
| H10W72/354 | 11 |
| H10W72/07336 | 10 |
| H10W72/352 | 10 |