Die attach methods and semiconductor devices manufactured based on such methods

Patent metadata

Field	Value
Publication number	US-11296015-B2
Application number	US-202017036271-A
Country	US
Kind code	B2
Filing date	Sep 29, 2020
Priority date	Aug 4, 2016
Publication date	Apr 5, 2022
Grant date	Apr 5, 2022

Abstract

A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a carrier;
a power semiconductor die that comprises first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively;
a die attach material arranged between the carrier and the first electrode,
wherein the die attach material forms a fillet at the side surface of the power semiconductor die,
wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die,
wherein the height of the power semiconductor die is a length of the side surface, and
wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers,
wherein the die attach material is disposed on a planar die mounting surface of the carrier, and
wherein an exposed region of the planar die mounting surface is disposed outside of the maximum extension of the die attach material and intersects an outer boundary of the die attach material.

2. The semiconductor device of claim 1 , wherein the die attach material extends over the edges of the main surface of the semiconductor die facing the die attach material at more of about 50% of the overall length of the edges.

3. The semiconductor device of claim 1 , wherein the carrier comprises at least one of a lead, a die pad, a leadframe, a printed circuit board, a ceramic, a metal plated ceramic, a substrate, and a power electronic substrate.

4. The semiconductor device of claim 1 , wherein the maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

5. The semiconductor device of claim 1 , wherein the power semiconductor die is configured to control a vertical current flowing between the first and second electrodes.

6. The semiconductor device of claim 1 , wherein an average bondline thickness of the die attach material is in a range from about 10 micrometers to about 80 micrometers.

7. The semiconductor device of claim 1 , wherein a tilt of the semiconductor die or the die attach material is less than about 15 micrometers.

8. The semiconductor device of claim 1 , wherein the fillet has a shape of a meniscus.

9. The semiconductor device of claim 1 , wherein the height of the power semiconductor die is less than about 400 micrometers.

10. The semiconductor device of claim 9 , wherein the height of the power semiconductor die is less than about 150 micrometers.

11. The semiconductor device of claim 10 , wherein the height of the power semiconductor die is between about 150 micrometers and about 20 micrometers.

12. The semiconductor device of claim 1 , wherein the die attach comprises an adhesive paste.

13. The semiconductor device of claim 12 , wherein the adhesive paste is a polymer based adhesive paste or an epoxy based adhesive paste.

14. The semiconductor device of claim 13 , wherein the die attach material comprises a polymeric material and at least one of electrically conductive and thermally conductive filler particles.

15. The semiconductor device of claim 13 , wherein the die attach material comprises filler particles that make the adhesive paste electrically conductive.

16. The semiconductor device of claim 15 , wherein the filler particles comprise at least one of silicon dioxide, aluminum oxide, alumina, boron nitride, silicon carbide, gallium nitride, and mixing systems thereof.

17. The semiconductor device of claim 15 , wherein the filler particles comprise at least one of silver, copper, nickel, gold, aluminum, and mixing systems thereof.

18. The semiconductor device of claim 15 , wherein a thermal conductivity of the die attach material is greater than about 0.5 W/(m·K).

19. The semiconductor device of claim 18 , wherein the filler particles have a diameter of greater than 50 nm and less than 9 μm.

Assignees

• Infineon Technologies Ag

Inventors

• Mahler Joachim
• Garbin Giovanni Ragasa
• Lee Chen Wen
• Reichert Benjamin
• Strobel Peter

Classifications

• H10W72/07353

  changes in shapes · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/334

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/332

  Plan-view shape, i.e. in top view · CPC title