Package with separate substrate sections

Patent metadata

Field	Value
Publication number	US-11710684-B2
Application number	US-202017070427-A
Country	US
Kind code	B2
Filing date	Oct 14, 2020
Priority date	Oct 15, 2019
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.

First claim

What is claimed is:

1. A package, wherein the package comprises:
a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess;
an electronic component mounted on the front side of the substrate;
a single encapsulant filling at least part of the at least one second recess;
an underfill between the front side of the substrate and the electronic component, the underfill also fills the at least one first recess at the front side of the substrate,
wherein the encapsulant fully circumferentially surrounds sidewalls of at least one substrate section of the plurality of substrate sections along at least part of a vertical extension of said at least one substrate section without being interrupted by said at least one substrate section along an entire vertical extension over which the encapsulant surrounds said at least one substrate section.

2. The package according to claim 1 ,
wherein the encapsulant fully circumferentially surrounds said sidewalls of said at least one of the substrate sections along at least part of the vertical extension of said at least one substrate section without being interrupted by said at least one substrate section so that the encapsulant disables a lateral electric access to said at least one substrate section along the entire vertical extension over which the encapsulant surrounds said at least one substrate section.

3. The package according to claim 1 , wherein the at least one first recess has a different, in particular a smaller, lateral extension than the at least one second recess.

4. The package according to claim 1 , wherein at least part of the substrate sections has a different, in particular a smaller, lateral extension at the front side than at the back side.

5. The package according to claim 1 , wherein different substrate sections have different vertical extensions.

6. The package according to claim 1 , comprising at least one further electronic component mounted on the front side of the substrate, wherein in particular the electronic component and the at least one further electronic component are arranged side-by-side or vertically stacked.

7. The package according to claim 1 , wherein the encapsulant encapsulates only part of the substrate and/or at least part of the electronic component, in particular wherein a part of the electronic component is exposed with respect to the encapsulant.

8. The package according to claim 1 , wherein the substrate further comprises at least one locking recess filled at least partially with the encapsulant to thereby lock the encapsulant with the substrate.

9. The package according to claim 8 , wherein the at least one locking recess has a frustoconical shape.

10. The package according to claim 1 , wherein the encapsulant and the underfill comprise different materials.

11. The package according to claim 1 , wherein the underfill comprises an etch stop.

12. The package according to claim 1 , comprising a connection structure connecting the electronic component with at least two of the separate substrate sections and holding together at least two substrate sections.

13. The package according to claim 12 , wherein the connection structure comprises a clip connecting an upper main surface of the electronic component with the front side of the substrate.

14. The package according to claim 1 , wherein the substrate sections are one of the group consisting of etched structures, laser machined structures, structures formed by additive metal deposition, structures formed by imprinting, structures formed by hot embossing, structures formed by milling, and structures formed by erosion.

15. The package according to claim 1 , wherein a vertical end face of said at least one substrate section having sidewalls being fully circumferentially surrounded by the encapsulant is electrically connected to the electronic component and/or is exposed with respect to the encapsulant.

16. The package according to claim 1 , wherein the at least one first recess and the at least one second recess together form at least one through hole extending through the substrate.

17. A package, wherein the package comprises:
a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess;
a single encapsulant filling at least part of the at least one second recess;
wherein the encapsulant fully circumferentially surrounds sidewalls of at least one substrate section of the plurality of substrate sections along at least part of a vertical extension of said at least one substrate section without being interrupted by said at least one substrate section along an entire vertical extension over which the encapsulant surrounds said at least one substrate section;
an adhesive attach film attached to the front side of the substrate and filling the at least one first recess; and
an electronic component attached to the adhesive attach film.

18. The package according to claim 17 , comprising a bond wire connecting a contact pad on an upper main surface of the electronic component to the front side of the substrate.

Assignees

• Infineon Technologies Ag

Inventors

• Singer Frank
• Gruber Martin
• Meyer Thorsten
• Scharf Thorsten
• Strobel Peter
• Woetzel Stefan

Classifications

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W76/05

  Providing fillings in containers, e.g. gas filling · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W70/421

  Shapes or dispositions · CPC title