Method of plating and apparatus for plating
US-12516437-B2 · Jan 6, 2026 · US
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Shimoyama Masashi patents
Shimoyama Masashi is listed as an inventor on 116 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shimoyama Masashi |
| Total patents | 116 |
| First publication | May 21, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Plating apparatus and plating method
US-2025283242-A1 · Sep 11, 2025 · US
Plate, apparatus for plating, and method of manufacturing plate
US-12359338-B2 · Jul 15, 2025 · US
Plating apparatus
US-12351931-B2 · Jul 8, 2025 · US
Plating apparatus and plating method
US-12351929-B2 · Jul 8, 2025 · US
Plating apparatus
US-12344954-B2 · Jul 1, 2025 · US
Plating apparatus and plating method
US-2025207290-A1 · Jun 26, 2025 · US
Plating apparatus and plating method
US-12331420-B2 · Jun 17, 2025 · US
Plating apparatus
US-2025146167-A1 · May 8, 2025 · US
Substrate state measurement device, plating apparatus, and substrate state measurement method
US-2025146952-A1 · May 8, 2025 · US
Recent patents
Latest publications not already listed above.
Plating apparatus and operation method of plating apparatus
US-2025116026-A1 · Apr 10, 2025 · US
Plating apparatus and plating method
US-12270120-B2 · Apr 8, 2025 · US
Method of plating and apparatus for plating
US-2025075364-A1 · Mar 6, 2025 · US
Method of adjusting plating module
US-2025051955-A1 · Feb 13, 2025 · US
Plating method and plating apparatus
US-12221714-B2 · Feb 11, 2025 · US
Resistor for plating apparatus, and plating apparatus
US-2025034744-A1 · Jan 30, 2025 · US
Method of adjusting plating module
US-12163244-B2 · Dec 10, 2024 · US
Plating apparatus and air bubble removing method of plating apparatus
US-12152312-B2 · Nov 26, 2024 · US
Plating apparatus
US-2024314936-A1 · Sep 19, 2024 · US
Plating apparatus
US-2024301582-A1 · Sep 12, 2024 · US
Plating apparatus
US-2024295045-A1 · Sep 5, 2024 · US
Air bubble removing method of plating apparatus and plating apparatus
US-12077875-B2 · Sep 3, 2024 · US
Resistor and plating apparatus
US-2024279837-A1 · Aug 22, 2024 · US
Plating apparatus and plating method
US-2024247394-A1 · Jul 25, 2024 · US
Plating apparatus
US-2024218553-A1 · Jul 4, 2024 · US
Method of adjusting plating module
US-2024183059-A1 · Jun 6, 2024 · US
Paddle, processing apparatus having the paddle, and method of producing the paddle
US-11891715-B2 · Feb 6, 2024 · US
Substrate holder, apparatus for plating, and method of manufacturing apparatus for plating
US-2023383431-A1 · Nov 30, 2023 · US
Plating apparatus
US-2023366120-A1 · Nov 16, 2023 · US
Plating apparatus
US-2023340688-A1 · Oct 26, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 116 |
| Yasuda Shingo | 1 |
| Kuriyama Fumio | 1 |
| Shimoyama Masashi | 1 |
| Nagai Mizuki | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 104 |
| C25D17/06 | 81 |
| C25D21/12 | 70 |
| C25D17/008 | 53 |
| C25D17/00 | 52 |