Plating apparatus and plating method

Patent metadata

Field	Value
Publication number	US-12351929-B2
Application number	US-202117608424-A
Country	US
Kind code	B2
Filing date	Mar 10, 2021
Priority date	Mar 10, 2021
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

To improve uniformity of a plating film-thickness formed on a substrate.A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.

First claim

The invention claimed is:

1. A plating apparatus comprising:
a plating tank for housing a plating solution;
a substrate holder for holding a substrate;
an anode housed within the plating tank;
an anode mask arranged between the substrate held by the substrate holder and the anode, the anode mask being provided with an opening in a center of the anode mask, the anode mask configured such that a size of a diameter of the opening is adjustable;
an ionically resistive element arranged at an interval from the anode mask between the substrate held by the substrate holder and the anode mask, the ionically resistive element being provided with a plurality of holes,
a sensor configured to measure a plating film-thickness distribution or a current density distribution along a radial direction of a surface to be plated of the substrate held by the substrate holder, wherein the anode mask is configured to adjust the size of the diameter of the opening based on the plating film-thickness distribution or the current density distribution measured by the sensor, and
a paddle arranged between the substrate held by the substrate holder and the ionically resistive element, wherein the paddle is secured to the substrate holder.

2. The plating apparatus according to claim 1 , further comprising
a distance adjustment mechanism for adjusting a distance between the substrate holder and the ionically resistive element.

3. A plating apparatus comprising:
a plating tank for housing a plating solution;
a substrate holder for holding a substrate;
an anode housed within the plating tank;
an anode mask arranged between the substrate held by the substrate holder and the anode, the anode mask being provided with an opening in a center of the anode mask;
an ionically resistive element arranged at an interval from the anode mask between the substrate held by the substrate holder and the anode mask, the ionically resistive element being provided with a plurality of holes,
a distance adjustment mechanism for adjusting a distance between the substrate holder and the ionically resistive element,
a paddle arranged between the substrate held by the substrate holder and the ionically resistive element; and
a paddle position adjustment mechanism for adjusting a position of the paddle, wherein
the paddle position adjustment mechanism is configured to adjust the position of the paddle in synchronization with a position adjustment of the substrate holder by the distance adjustment mechanism.

Assignees

• Ebara Corp

Inventors

• Masuda Yasuyuki
• Shimoyama Masashi

Classifications

• C25D17/008

  Current shielding devices · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title