Method of adjusting plating module

Patent metadata

Field	Value
Publication number	US-12163244-B2
Application number	US-202117781363-A
Country	US
Kind code	B2
Filing date	Mar 5, 2021
Priority date	Mar 5, 2021
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

First claim

The invention claimed is:

1. A method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element,
the method comprising:
providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and
adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

2. The method according to claim 1 , further comprising
performing simulation by taking into account misalignment of center axes of respective components, a difference in degree of parallelism and/or dimensional tolerances of respective components of the plating module to determine a module configuration of the plating module of the initial setting, wherein
the respective components include the substrate holder, the anode and the plate.

3. The method according to claim 2 ,
wherein the simulation comprises:
determining a module configuration of a standard condition that provides zero or minimum misalignment of the center axes of the respective components, zero or minimum difference in degree of parallelism and/or zero or minimum dimensional tolerances of the respective components in the plating module and a module configuration of a first condition that provides a maximum plating film thickness in the outer circumferential portion of the substrate due to the misalignment of the center axes of the respective components, the difference in degree of parallelism and/or the dimensional tolerances of the respective components in the plating module;
determining a porosity in the outer circumferential portion of the plate, such as to reduce the film thickness distribution in the outer circumferential portion of the substrate to be smaller than a film thickness distribution in another portion with regard to the module configuration of the first condition; and
applying the determined porosity to the module configuration of the standard condition, so as to determine the module configuration of the initial setting.

4. The method according to any one of claim 1 ,
wherein the plating module further comprises a paddle placed between the substrate holder and the plate to stir a plating solution, wherein
the method further comprising:
adjusting a position of the paddle relative to the substrate holder and/or a motion velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of the distance between the substrate holder and the plate.

5. The method according to claim 4 ,
the adjusting the distance between the substrate holder and the plate comprises moving the substrate holder and the paddle by an identical distance, so as to keep a distance between the substrate holder and the paddle constant.

6. The method according to claim 5 ,
wherein the distance between the substrate holder and the paddle is kept constant by integrally moving the substrate holder and the paddle.

7. The method according to claim 5 ,
wherein the distance between the substrate holder and the paddle is kept constant by separately moving the substrate holder and the paddle by an identical distance.

8. The method according to claim 4 ,
wherein the motion velocity of the paddle is adjusted to keep constant the flow rate of the plating solution on the surface of the substrate by stirring with the paddle, before and after adjustment of the distance between the substrate holder and the plate.

9. The method according to claim 4 ,
wherein adjustment of the position of the paddle and adjustment of the motion velocity of the paddle are combined, such as to keep constant the flow rate of the plating solution on the surface of the substrate by stirring with the paddle, before and after adjustment of the distance between the substrate holder and the plate.

10. The method according to any one of claim 1 ,
wherein the porosity in the outer circumferential portion of the plate is adjusted by adjusting an opening area of apertures provided on an outermost circumference or provided on the outermost circumference and one or multiple adjacent circumferences adjacent to the outermost circumference, among apertures provided on a plurality of concentric circumferences on the plate.

11. A non-volatile storage medium storing therein a program that causes a computer to perform a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element,
the program causing the computer to adjust a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in an outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in the outer circumferential portion of the substrate to be smaller than a film thickness in another portion.

12. The storage medium according to claim 11 ,
wherein the plating module further comprises a paddle placed between the substrate holder and the plate to stir a plating solution, and
wherein the program causing the computer to adjust a position of the paddle relative to the substrate holder and/or a motion velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of a distance between the substrate holder and the plate.

Assignees

• Ebara Corp

Inventors

• Masuda Yasuyuki
• Hiwatashi Ryosuke
• Shimoyama Masashi

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/08

  Supporting} racks {, i.e. not for suspending · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title