Method of adjusting plating module

Patent metadata

Field	Value
Publication number	US-2025051955-A1
Application number	US-202418929090-A
Country	US
Kind code	A1
Filing date	Oct 28, 2024
Priority date	Mar 5, 2021
Publication date	Feb 13, 2025
Grant date	—

Abstract

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

First claim

What is claimed:

1 . An apparatus for plating, comprising:
a plating module comprising a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element and being set to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and a first moving mechanism configured to move the substrate holder and/or the plate.

2 . The apparatus for plating according to claim 1 , further comprising:
a paddle placed between the substrate holder and the plate to stir a plating solution, wherein the first moving mechanism is configured to move the substrate holder and the paddle integrally relative to the plate.

3 . The apparatus for plating according to claim 1 , further comprising:
a paddle placed between the substrate holder and the plate to stir a plating solution; and a second moving mechanism configured to move the paddle to be closer to and away from the substrate holder.

4 . The apparatus for plating according to claim 1 , further comprising:
a control module, wherein the control module controls the first moving mechanism according to a film thickness distribution of the substrate plated in the plating module, so as to adjust the distance between the substrate holder and the plate.

5 . The apparatus for plating according to claim 2 , further comprising:
a control module, wherein the control module controls the first moving mechanism to move the substrate holder and the paddle integrally, while keeping a distance between the substrate holder and the paddle constant.

6 . The apparatus for plating according to claim 3 , further comprising:
a control module, wherein the control module controls the first moving mechanism and the second moving mechanism to move the substrate holder and the paddle, such as to keep a distance between the substrate holder and the paddle constant.

7 . The apparatus for plating according to claim 1 , further comprising:
a paddle placed between the substrate holder and the plate to stir a plating solution; a driving mechanism configured to reciprocate the paddle parallel to the substrate; and a control module, wherein the control module controls the driving mechanism to adjust a moving velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of a distance between the substrate holder and the plate.

8 . The apparatus for plating according to claim 1 , further comprising:
a paddle placed between the substrate holder and the plate to stir a plating solution; a second moving mechanism configured to move the paddle to be closer to and away from the substrate holder; a driving mechanism configured to reciprocate the paddle parallel to the substrate; and a control module, wherein the control module controls the second moving mechanism and the driving mechanism to move the paddle and to adjust a motion velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of a distance between the substrate holder and the plate.

Assignees

• Ebara Corp

Inventors

• Masuda Yasuyuki
• Hiwatashi Ryosuke
• Shimoyama Masashi

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/08

  Supporting} racks {, i.e. not for suspending · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title