Plating apparatus

Patent metadata

Field	Value
Publication number	US-12344954-B2
Application number	US-202217923563-A
Country	US
Kind code	B2
Filing date	Feb 7, 2022
Priority date	Feb 7, 2022
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

In a plating apparatus including a shielding member, an ionically resistive element is disposed to be close to a surface to be plated of a substrate to improve uniformity of a distribution of plating film-thickness.
A plating apparatus includes: a plating tank 410 configured to house a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; an anode 430 disposed in the plating tank 410 ; an ionically resistive element 450 disposed between the substrate Wf and the anode 430 and including an opposed surface 450 - a opposed to the surface to be plated Wf-a, the opposed surface 450 - a including a first opposed surface 450 - a 1 and a second opposed surface 450 - a 2 apart from the surface to be plated Wf-a more than the first opposed surface 450 - a 1 ; and a shielding member 481 disposed in a depressed region β of the ionically resistive element 450 , the depressed region β being formed by the second opposed surface 450 - a 2 . The shielding member 481 is for shielding an electric field.

First claim

The invention claimed is:

1. A plating apparatus comprising:
a plating tank configured to house a plating solution;
a substrate holder configured to hold a substrate with a surface to be plated facing downward;
an anode disposed in the plating tank;
an ionically resistive element disposed between the substrate and the anode and including an opposed surface opposed to the surface to be plated, the opposed surface including a first opposed surface and a second opposed surface apart from the surface to be plated more than the first opposed surface; and
a shielding member disposed in a depressed region of the ionically resistive element, the depressed region being formed by the second opposed surface, the shielding member being for shielding an electric field,
wherein the ionically resistive element is formed such that a resistivity in the first opposed surface and a resistivity in the second opposed surface are made uniform
wherein the ionically resistive element is a plate-shaped member provided with a plurality of through-holes penetrating between the anode side and the substrate side, and the ionically resistive element is formed such that a thickness of the ionically resistive element in the first opposed surface is larger than a thickness of the ionically resistive element in the second opposed surface, and an opening rate of the first opposed surface by the plurality of through-holes is larger than an opening rate of the second opposed surface by the plurality of through-holes.

2. The plating apparatus according to claim 1 , wherein the second opposed surface is formed in a part of an outer edge portion of the opposed surface.

3. The plating apparatus according to claim 1 , further comprising:
a paddle disposed between the ionically resistive element and the substrate; and
a paddle stirring mechanism configured to reciprocate the paddle in the direction along the surface to be plated of the substrate.

4. A plating apparatus comprising:
a plating tank configured to house a plating solution;
a substrate holder configured to hold a substrate with a surface to be plated facing downward;
an anode disposed in the plating tank;
an ionically resistive element disposed between the substrate and the anode and including an opposed surface opposed to the surface to be plated, the opposed surface including a first opposed surface and a second opposed surface apart from the surface to be plated more than the first opposed surface;
a shielding member disposed in a depressed region of the ionically resistive element, the depressed region being formed by the second opposed surface, the shielding member being for shielding an electric field; and
a shielding mechanism configured to reciprocate the shielding member in a direction along the surface to be plated of the substrate between a shielding position and a retracted position corresponding to a rotation angle of the substrate holder, the shielding position being between the second opposed surface of the ionically resistive element and the substrate, the retracted position being apart from between the second opposed surface of the ionically resistive element and the substrate.

5. The plating apparatus according to claim 4 , wherein
the ionically resistive element is formed such that a resistivity in the first opposed surface and a resistivity in the second opposed surface are made uniform.

6. The plating apparatus according to claim 4 , wherein
the ionically resistive element is a plate-shaped member provided with a plurality of through-holes penetrating between the anode side and the substrate side, and the ionically resistive element is formed such that a thickness of the ionically resistive element in the first opposed surface and a thickness of the ionically resistive element in the second opposed surface are made uniform.

7. The plating apparatus according to claim 4 , wherein
the ionically resistive element is a plate-shaped member provided with a plurality of through-holes penetrating between the anode side and the substrate side, and the ionically resistive element is formed such that a thickness of the ionically resistive element in the first opposed surface is larger than a thickness of the ionically resistive element in the second opposed surface, and an opening rate of the first opposed surface by the plurality of through-holes is larger than an opening rate of the second opposed surface by the plurality of through-holes.

8. The plating apparatus according to claim 4 , wherein
the second opposed surface is formed in a part of an outer edge portion of the opposed surface.

9. The plating apparatus according to claim 4 , further comprising:
a paddle disposed between the ionically resistive element and the substrate; and
a paddle stirring mechanism configured to reciprocate the paddle in the direction along the surface to be plated of the substrate.

Assignees

• Ebara Corp

Inventors

• Wakuda Yohei
• Masuda Yasuyuki
• Shimoyama Masashi

Classifications

• C25D21/10 Primary

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/00

  Constructional parts, or assemblies thereof, of cells for electrolytic coating · CPC title