Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-12332271-B2 · Jun 17, 2025 · US
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Roeth Andre patents
Roeth Andre is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Roeth Andre |
| Total patents | 25 |
| First publication | Jun 30, 2016 |
| Latest publication | Jun 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of generating a germanium structure and optical device comprising a germanium structure
US-11594654-B2 · Feb 28, 2023 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-2022326275-A1 · Oct 13, 2022 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-11422151-B2 · Aug 23, 2022 · US
Producing a buried cavity in a semiconductor substrate
US-11393714-B2 · Jul 19, 2022 · US
Method of generating a germanium structure and optical device comprising a germanium structure
US-2022069156-A1 · Mar 3, 2022 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
US-11078072-B2 · Aug 3, 2021 · US
Producing a buried cavity in a semiconductor substrate
US-2021013087-A1 · Jan 14, 2021 · US
Stressed decoupled micro-electro-mechanical system sensor
US-10870575-B2 · Dec 22, 2020 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-2020300886-A1 · Sep 24, 2020 · US
Recent patents
Latest publications not already listed above.
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a cmos process
US-2020290867-A1 · Sep 17, 2020 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
US-10683203-B2 · Jun 16, 2020 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-10684306-B2 · Jun 16, 2020 · US
Integrated semiconductor device and manufacturing method
US-10544037-B2 · Jan 28, 2020 · US
Stressed decoupled micro-electro-mechanical system sensor
US-2020002159-A1 · Jan 2, 2020 · US
Pressure sensor device and manufacturing method
US-10386255-B2 · Aug 20, 2019 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a cmos process
US-2018297838-A1 · Oct 18, 2018 · US
Sensor structures, systems and methods with improved integration and optimized footprint
US-10060816-B2 · Aug 28, 2018 · US
Integrated semiconductor device and manufacturing method
US-2018155188-A1 · Jun 7, 2018 · US
Integrated semiconductor device and manufacturing method
US-9896329-B2 · Feb 20, 2018 · US
Pressure sensor device and manufacturing method
US-2018017456-A1 · Jan 18, 2018 · US
Sensor structures, systems and methods with improved integration and optimized footprint
US-2017089790-A1 · Mar 30, 2017 · US
Integrated semiconductor device and manufacturing method
US-2017015546-A1 · Jan 19, 2017 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-2017010301-A1 · Jan 12, 2017 · US
Systems and methods for horizontal integration of acceleration sensor structures
US-2016185594-A1 · Jun 30, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Dresden Gmbh | 11 |
| Infineon Technologies Ag | 11 |
| Infineon Tech Dresden Gmbh & Co Kg | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0235 | 15 |
| B81B2207/015 | 11 |
| B81B2203/0118 | 10 |
| B81B7/02 | 7 |
| H10P14/40 | 6 |