Patternable die attach materials and processes for patterning
US-12568831-B2 · Mar 3, 2026 · US
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Paital Sameer patents
Paital Sameer is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Paital Sameer |
| Total patents | 42 |
| First publication | Sep 12, 2019 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
High bandwidth optical interconnection architectures
US-12517314-B2 · Jan 6, 2026 · US
Lithographic cavity formation to enable emib bump pitch scaling
US-2025323166-A1 · Oct 16, 2025 · US
Lithographic cavity formation to enable EMIB bump pitch scaling
US-12354963-B2 · Jul 8, 2025 · US
Lithographic cavity formation to enable EMIB bump pitch scaling
US-12334443-B2 · Jun 17, 2025 · US
Microelectronic structures including glass substrates with dielectric based liner materials.
US-2025112138-A1 · Apr 3, 2025 · US
Through-glass via liners for integrated circuit device packages
US-2025112163-A1 · Apr 3, 2025 · US
Substrate embedded magnetic core inductors and method of making
US-12230430-B2 · Feb 18, 2025 · US
Substrate process flow for enabling substrate to die hybrid bonding
US-2024421043-A1 · Dec 19, 2024 · US
Lithographic cavity formation to enable emib bump pitch scaling
US-2024243066-A1 · Jul 18, 2024 · US
Recent patents
Latest publications not already listed above.
Zero misaligned pad and via metallization structures in glass package substrates
US-2024222282-A1 · Jul 4, 2024 · US
Lithographic cavity formation to enable emib bump pitch scaling
US-2024178145-A1 · May 30, 2024 · US
Hybrid bonded passive integrated devices on glass core
US-2024114623-A1 · Apr 4, 2024 · US
Patternable die attach materials and processes for patterning
US-2024088052-A1 · Mar 14, 2024 · US
Lithographic cavity formation to enable EMIB bump pitch scaling
US-11929330-B2 · Mar 12, 2024 · US
Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages
US-11929212-B2 · Mar 12, 2024 · US
Patternable die attach materials and processes for patterning
US-11923312-B2 · Mar 5, 2024 · US
Packaging architecture with cavities for embedded interconnect bridges
US-2023420378-A1 · Dec 28, 2023 · US
Silicon nitride layer under a copper pad
US-2023420357-A1 · Dec 28, 2023 · US
Selective deposition of embedded thin-film resistors for semiconductor packaging
US-11728265-B2 · Aug 15, 2023 · US
Substrate embedded magnetic core inductors and method of making
US-2023146165-A1 · May 11, 2023 · US
Protective coating on an edge of a glass core
US-2023087838-A1 · Mar 23, 2023 · US
Thermally conductive sleeves around tgvs for improved heat dissipation in glass core substrates or glass interposers
US-2023088392-A1 · Mar 23, 2023 · US
Methods and apparatus to embed host dies in a substrate
US-2023092903-A1 · Mar 23, 2023 · US
Dielectric layer separating a metal pad of a through glass via from a surface of the glass
US-2023092242-A1 · Mar 23, 2023 · US
Glass core with cavity structure for heterogeneous packaging architecture
US-2023085411-A1 · Mar 16, 2023 · US
Thin film barrier seed metallization in magnetic-plugged through hole inductor
US-11443885-B2 · Sep 13, 2022 · US
Substrate embedded magnetic core inductors and method of making
US-2022254559-A1 · Aug 11, 2022 · US
Lithographic cavity formation to enable emib bump pitch scaling
US-2022223527-A1 · Jul 14, 2022 · US
Substrate embedded magnetic core inductors and method of making
US-11348718-B2 · May 31, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 42 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 32 |
| H10W70/611 | 29 |
| H10W90/00 | 26 |
| H10W90/401 | 23 |
| H10W70/65 | 23 |