High bandwidth optical interconnection architectures

Patent metadata

Field	Value
Publication number	US-12517314-B2
Application number	US-202016953146-A
Country	US
Kind code	B2
Filing date	Nov 19, 2020
Priority date	Nov 19, 2020
Publication date	Jan 6, 2026
Grant date	Jan 6, 2026

Abstract

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

First claim

What is claimed is:

1 . An optical package, comprising:
a package substrate having an uppermost surface; a first photonics die and a second photonics die coupled to the package substrate; a compute die coupled to the package substrate, the compute die laterally between the first photonics die and the second photonics die, wherein the first photonics die is coupled to the compute die by a first bridge in the package substrate, and the second photonics die is coupled to the compute die by a second bridge in the package substrate, wherein each of the first bridge and the second bridge is a discrete component set in a cavity in the package substrate, and wherein each of the first bridge and the second bridge has an uppermost surface below the uppermost surface of the package substrate; and a first optical waveguide and a second optical waveguide embedded in the package substrate, wherein a first end of the first optical waveguide is below the first photonics die and wherein a first end of the second optical waveguide is below the second photonics die, wherein a second end of the first optical waveguide is substantially coplanar with a first edge of the package substrate and a second end of the second optical waveguide is substantially coplanar with a second edge of the package substrate, and wherein the first optical waveguide is laterally spaced apart from the first bridge, and the second optical waveguide is laterally spaced apart from the second bridge.

2 . The optical package of claim 1 , wherein the first end of each of the first the optical waveguide and the second optical waveguide is angled.

3 . The optical package of claim 1 , further comprising:
a solder resist over the package substrate; and an optical path from the first end of the first optical waveguide through the solder resist.

4 . The optical package of claim 3 , wherein the optical path comprises a cladding and a core.

5 . The optical package of claim 4 , wherein the cladding comprises a polyimide, a polyalkane, a polycyanate, a polyacrylate, a polysiloxane, a metallic material, or a polyperflurocarbon polymer.

6 . The optical package of claim 4 , further comprising:
a first lens over the core; and a second lens over the second end of the first optical waveguide.

7 . The optical package of claim 1 , wherein an optical path into the first photonics die enters the first photonics die at a surface of the first photonics die facing the package substrate.

8 . The optical package of claim 1 , wherein each of the first optical waveguide and the second optical waveguide is in direct contact with the package substrate.

9 . The optical package of claim 8 , wherein a surface of the package substrate contacting the first optical waveguide and the second optical waveguide has a surface roughness of approximately 70 nm RMS or smoother.

10 . The optical package of claim 8 , wherein each of the first optical waveguide and the second optical waveguide comprises a polyimide, a polyalkane, a polycyanate, a diazobenzoquinone, a metal-centered dendrite polymer, a high-density polycarbonate, a polythiphene, a polythiadiazole, or a polysulfone.

11 . The optical package of claim 1 , wherein each of the first optical waveguide and the second optical waveguide is a discrete component embedded in the package substrate.

12 . The optical package of claim 11 , further comprising:
a mirror at the first end of the first optical waveguide, wherein the mirror is angled.

13 . The optical package of claim 1 , further comprising:
a silver coating between each of the first optical waveguide and the second optical waveguide and the package substrate.

14 . The optical package of claim 1 , wherein each of the first photonics die and the second photonics die is entirely within a footprint of the package substrate.

15 . The optical package of claim 1 , further comprising:
an underfill between the first photonics die and the package substrate, between the second photonics die and the package substrate, and between the compute die and the package substrate; and an underfill dam to prevent the flow of the underfill over the first end of the first optical waveguide.

16 . An optical system, comprising:
a board; a package substrate coupled to the board, the package substrate having an uppermost surface; a compute die coupled to the package substrate; a first photonics die and a second photonics die coupled to the package substrate, the compute die laterally between the first photonics die and the second photonics die, wherein the first photonics die is coupled to the compute die by a first bridge in the package substrate, and the second photonics die is coupled to the compute die by a second bridge in the package substrate, wherein each of the first bridge and the second bridge is a discrete component set in a cavity in the package substrate, and wherein each of the first bridge and the second bridge has an uppermost surface below the uppermost surface of the package substrate; and a first optical waveguide and a second optical waveguide embedded in the package substrate, wherein a first end of the first optical waveguide is below the first photonics die and wherein a first end of the second optical waveguide is below the second photonics die, wherein a second end of the first optical waveguide is substantially coplanar with a first edge of the package substrate and a second end of the second optical waveguide is substantially coplanar with a second edge of the package substrate, and wherein the first optical waveguide is laterally spaced apart from the first bridge, and the second optical waveguide is laterally spaced apart from the second bridge.

17 . The optical system of claim 16 , wherein the first end of each of the first optical waveguide and the second optical waveguide is angled.

Assignees

• Intel Corp

Inventors

• Pietambaram Srinivas V
• Marin Brandon C
• Paital Sameer
• Vadlamani Sai
• Manepalli Rahul N
• Li Xiaoqian
• Pothukuchi Suresh V
• Sharan Sujit
• Sarkar Arnab
• Karhade Omkar
• Deshpande Nitin
• Pratap Divya
• Ecton Jeremy
• Mallik Debendra
• Mahajan Ravindranath V
• Zhang Zhichao
• Aygün Kemal
• Nie Bai
• Darmawikarta Kristof
• Jaussi James E
• Gamba Jason M
• Casper Bryan K
• Duan Gang
• Inti Rajesh
• Mansuri Mozhgan
• Jadhav Susheel
• Brown Kenneth
• Agrawal Ankur
• Dobriyal Priyanka

Classifications

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4248 Primary

  Feed-through connections for the hermetical passage of fibres through a package wall (see provisionally also G02B6/4428) · CPC title

• G02B6/4243

  Mounting of the optical light guide into a groove (mounting optical light guides into a groove in general G02B6/3636) · CPC title

• G02B6/4232

  using the surface tension of fluid solder to align the elements, e.g. solder bump techniques (flip-chip mounting techniques in assembly of semiconductor devices H10W72/072) · CPC title

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title