Module
US-2026053021-A1 · Feb 19, 2026 · US
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Otani Shinji patents
Otani Shinji is listed as an inventor on 90 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Otani Shinji |
| Total patents | 90 |
| First publication | Mar 24, 2015 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
US-12542242-B2 · Feb 3, 2026 · US
Module
US-12482732-B2 · Nov 25, 2025 · US
Multilayer ceramic capacitor
US-2025191843-A1 · Jun 12, 2025 · US
Electronic component and method for manufacturing the same
US-12288636-B2 · Apr 29, 2025 · US
Multilayer ceramic capacitor
US-2024387106-A1 · Nov 21, 2024 · US
Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
US-2024363289-A1 · Oct 31, 2024 · US
Module and semiconductor composite device
US-2024332346-A1 · Oct 3, 2024 · US
Electronic component
US-12020852-B2 · Jun 25, 2024 · US
Capacitor, connection structure, and method for manufacturing capacitor
US-11972909-B2 · Apr 30, 2024 · US
Recent patents
Latest publications not already listed above.
Inductor component
US-11948726-B2 · Apr 2, 2024 · US
Inductor component and manufacturing method of inductor component
US-11842842-B2 · Dec 12, 2023 · US
Multilayer metal film and inductor component
US-11810706-B2 · Nov 7, 2023 · US
Electronic component and production method thereof
US-11804325-B2 · Oct 31, 2023 · US
Multilayer metal film and inductor component
US-11798723-B2 · Oct 24, 2023 · US
Electronic component and mounting structure
US-11776754-B2 · Oct 3, 2023 · US
Electronic component and production method thereof
US-11721469-B2 · Aug 8, 2023 · US
Base configured as an electronic component or a circuit board
US-11694839-B2 · Jul 4, 2023 · US
Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
US-2023207222-A1 · Jun 29, 2023 · US
Electronic component and method of manufacturing electronic component
US-11676757-B2 · Jun 13, 2023 · US
Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
US-11626250-B2 · Apr 11, 2023 · US
Module
US-2022278035-A1 · Sep 1, 2022 · US
Capacitor, connection structure, and method for manufacturing capacitor
US-2022165508-A1 · May 26, 2022 · US
Electronic component and mounting structure
US-2022044873-A1 · Feb 10, 2022 · US
Electronic component and method for manufacturing the same
US-2022020524-A1 · Jan 20, 2022 · US
Electronic component
US-2022020526-A1 · Jan 20, 2022 · US
Electronic component
US-11227715-B2 · Jan 18, 2022 · US
Inductor component and manufacturing method of inductor component
US-2021265097-A1 · Aug 26, 2021 · US
Method for producing a ceramic electronic component
US-11017950-B2 · May 25, 2021 · US
Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
US-2021098195-A1 · Apr 1, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Murata Manufacturing Co | 74 |
| Mitsubishi Materials Corp | 8 |
| Kyocera Document Solutions Inc | 8 |
| Otani Shinji | 6 |
| Zenzai Kota | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/30 | 32 |
| H01F27/292 | 26 |
| H01F27/255 | 24 |
| H01G4/012 | 20 |
| H01F27/2804 | 20 |