Electronic component and production method thereof

US11804325B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11804325-B2
Application numberUS-202016995103-A
CountryUS
Kind codeB2
Filing dateAug 17, 2020
Priority dateSep 3, 2019
Publication dateOct 31, 2023
Grant dateOct 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic component, comprising: a composite body composed of a composite material of a resin and a magnetic metal powder; and a metal film disposed on an outer surface of the composite body, the magnetic metal powder containing Fe, the metal film containing Cu in an amount of 95% by weight or greater, further containing Fe, and being in contact with the magnetic metal powder, wherein the metal film has an Fe content of from about 0.01% by weight to about 2.6% by weight with respect to Cu. 2. The electronic component according to claim 1 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a cover film covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the cover film are included in an external terminal. 3. The electronic component according to claim 1 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a cover film covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the cover film are included in an external terminal. 4. The electronic component according to claim 1 , wherein the metal film further contains Ni. 5. The electronic component according to claim 4 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a cover film covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the cover film are included in an external terminal. 6. A method for producing an electronic component according to claim 1 , the method comprising: forming a metal film on an outer surface of a composite body by electroless plating treatment, wherein the metal film is deposited on the magnetic metal powder containing Fe by an electroless plating treatment and is in contact with the resin.

Assignees

Inventors

Classifications

  • Printed windings · CPC title

  • made from particles (H01F27/26 takes precedence) · CPC title

  • Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

  • Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

  • on stacked layers · CPC title

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Frequently asked questions

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What does patent US11804325B2 cover?
An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).