Electronic component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-12288636-B2
Application number	US-202117371693-A
Country	US
Kind code	B2
Filing date	Jul 9, 2021
Priority date	Jul 16, 2020
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 μm or more.

First claim

What is claimed is:

1. An electronic component comprising:
a composite body containing resin and magnetic metal particles;
a first metal film provided on an outer surface of the composite body; and
a second metal film provided on the first metal film, wherein
at least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film,
the first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface of the composite body,
a film thickness of the first metal film on the exposed surface of the at least one of the magnetic metal particles is 2.9 μm or greater,
two or more of the magnetic metal particles being a first magnetic metal particle and a second magnetic metal particle are exposed at the contact surface of the composite body, and
a distance between the first magnetic metal particle and the second magnetic metal particle that are adjacent to each other is less than or equal to twice the film thickness of the first metal film on the first magnetic metal particle.

2. The electronic component according to claim 1 , wherein
the film thickness of the first metal film on the exposed surface is 15 μm or less.

3. The electronic component according to claim 2 , wherein
an average film thickness of the first metal film is 2.9 μm or greater.

4. The electronic component according to claim 2 , wherein
an average film thickness of the first metal film is 5 μm or greater.

5. The electronic component according to claim 2 , wherein
the magnetic metal particles contain Fe.

6. The electronic component according to claim 2 , wherein
the first metal film contains Cu.

7. The electronic component according to claim 2 , wherein
the second metal film contains Ni.

8. The electronic component according to claim 1 , wherein
the distance between the first magnetic metal particle and the second magnetic metal particle is less than or equal to twice a film thickness that is smaller one of the film thickness of the first metal film on the first magnetic metal particle and a film thickness of the first metal film on the second magnetic metal particle.

9. The electronic component according to claim 8 , wherein
two or more of the magnetic metal particles are exposed at the contact surface of the composite body and,
in 95% or more of the magnetic metal particles exposed, a distance between the magnetic metal particles adjacent to each other is less than or equal to twice an average film thickness of the first metal film.

10. The electronic component according to claim 1 , wherein
an average film thickness of the first metal film is 2.9 μm or greater.

11. The electronic component according to claim 10 , wherein
two or more of the magnetic metal particles are exposed at the contact surface of the composite body and,
in 95% or more of the magnetic metal particles exposed, a distance between the magnetic metal particles adjacent to each other is less than or equal to twice an average film thickness of the first metal film.

12. The electronic component according to claim 1 , wherein
an average film thickness of the first metal film is 5 μm or greater.

13. The electronic component according to claim 1 , wherein
the magnetic metal particles contain Fe.

14. The electronic component according to claim 1 , wherein
the first metal film contains Cu.

15. The electronic component according to claim 1 , wherein
the second metal film contains Ni.

16. The electronic component according to claim 1 , further comprising:
a third metal film which is provided on the second metal film and which has solder wettability.

17. The electronic component according to claim 1 , further comprising:
an inductor wiring provided in the composite body, wherein
the first metal film and the second metal film define an external terminal electrically connected to the inductor wiring.

18. An electronic component comprising:
a composite body containing resin and magnetic metal particles;
a first metal film provided on an outer surface of the composite body; and
a second metal film provided on the first metal film, wherein
at least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film,
the first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface of the composite body,
a film thickness of the first metal film on the exposed surface of the at least one of the magnetic metal particles is 2.9 μm or greater,
an average film thickness of the first metal film is 2.9 μm or greater,
two or more of the magnetic metal particles are exposed at the contact surface of the composite body and,
in 95% or more of the magnetic metal particles exposed, a distance between the magnetic metal particles adjacent to each other is less than or equal to twice an average film thickness of the first metal film.

Assignees

• Murata Manufacturing Co

Inventors

• Otani Shinji
• Imaeda Hiroki
• Sasajima Namiko
• Sunaga Tomohiro
• Okado Masami
• Yoshioka Yoshimasa

Classifications

• H01F27/255 Primary

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F19/04

  Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range (resonant circuits H03H) · CPC title